Industry News | 2021-03-15 15:28:43.0
Semiconductor and Packaging Technology Leader Extends Leadership in Advanced Packaging and Heterogeneous Integration with High Volume Manufacturing Tools
Industry News | 2014-06-25 12:31:01.0
Panasonic Factory Solutions Company of America will debut a process-flexible flip chip bonder at this year’s Semicon West as part of its high-speed, low-cost manufacturing solutions for highly advanced devices.
Industry News | 2016-09-12 20:17:12.0
Essemtec today announced plans to exhibit in Booth #224 at IMAPS Pasadena, scheduled to take place Oct. 10-13, 2016 at the Pasadena Convention Center. Essemtec will demonstrate the new compact Spider jet dispenser. The Spider can utilize two dispensing valves rated at up to 150,000 dots per hour. It dispenses 3D patterns and is easily adapted to your application.
Industry News | 2016-07-25 15:46:30.0
Finetech, a global supplier of micro-assembly equipment, and Microtek, a microelectronics product development innovator, announce the addition of a FINEPLACER® Lambda bonding system at the recently opened Microtek facility. The die bonder will be used for customized packaging applications in prototype and development projects, including wireless, photonics and medical diagnostics and therapeutics.
Industry News | 2023-11-20 15:33:13.0
Soldering using formic acid vapor in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several innovations in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.
Industry News | 2007-11-27 12:13:09.0
FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.
Industry News | 2009-01-16 17:14:22.0
FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009
Industry News | 2011-06-01 23:22:00.0
Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.
Industry News | 2017-05-26 14:54:11.0
Versatile Hotbar Bonding System with Motorized Rotary Table for Precision Positioning
Industry News | 2003-04-16 10:58:03.0
Award presented for Palomar's Gold Connection
