As part of our commitment to being a Solutions Provider, Saline Lectronics also offers extensive testing services related to your circuit board assembly products. In addition to supporting each of the different types of testing requirements includin
Facilities: 230V 3ph 60Hz, 20amps Dims: 35" x 49" x 73" @ 875lbs Product Terms: This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or
1988 Thermotron FA-4-CH-1-1 Environmental Chamber Temperature Range: -73C to 177C (-99F to 351F) Control Accuracy: 1.0+/- C Internal Dimensions: 20" x 20" x 20" External Dimensions: 32" x 34" x 82" Power: 208VAC; 28A; 60Hz; 3 Phase Serial: 165
Industry News | 2015-07-28 10:36:48.0
EMS provider Canadian Inc. Energy Group in Laval, Quebec; Canada will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on August 10, 2015 and the closing will begin at 1:00pm EST on August 12, 2015.
Industry News | 2016-10-10 10:59:34.0
Sypris Electronics will be liquidating some of their assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 7:00am EDT on october 24, 2015 and the closing will begin at 11:00am EDT on November 11, 2016.
Technical Library | 2017-08-17 12:23:27.0
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou