Electronics Forum | Mon Feb 28 11:53:08 EST 2000 | Wendy Casker
Charlie, There are 2 ways to go and they both work. 1. Add thieving pads of the same size and pitch to all 4 corners 2. Make the exisiting 4 corner pads "doublewides" Both ways work. I like #2 because you don't get a bridge. Even though a bridge
Electronics Forum | Mon Feb 28 11:53:08 EST 2000 | Wendy Casker
Charlie, There are 2 ways to go and they both work. 1. Add thieving pads of the same size and pitch to all 4 corners 2. Make the exisiting 4 corner pads "doublewides" Both ways work. I like #2 because you don't get a bridge. Even though a bridge
Electronics Forum | Wed Oct 07 17:36:48 EDT 1998 | Ted Nicholas
Hello! Does any one know of a disadvantage of using the Phillips recommended wave solder SOIC footprint where the last pad on each side of the SOIC is enlarged, instead of placing an extra pair of pads behind the SOIC. Both footprint patterns seem e
Electronics Forum | Fri Jun 21 13:05:58 EDT 2002 | surinder
Hi Stephan, Thanks,Yes there are thieving pads on Ic's .Also the two QFP, which mention,that will be removed by modifying the design in long run ,if the results/Yields are okay as with Glue as Compared to solderpaste process. Yes you are right here,b
Electronics Forum | Tue Oct 15 08:27:31 EDT 2002 | davef
I can't comment on 20 pitch TSOP, but wave soldering wider pitch parts require: * Orienting components with the leads perpendicular to the wave [moving parallel to the rails]. * Thieving [robbing] pads on trailing pads for the component. Search the
Electronics Forum | Tue Oct 13 12:32:43 EDT 2009 | davef
2.6.3 Test Pad Location Tolerances, third bullet. Why does Entek require different test point spacing than other surface finishes? Page 55, top image is off the page, partially. 2.3.6 Depanelization of Arrays, 10th bullet [Breakaway Scoring] refers
Electronics Forum | Wed Oct 23 14:45:00 EDT 2002 | Tom G
I haven't tried anything like that but had some experience with .8 mm pitch SSOPs. Immersion depth in wave was very critical- had to control Lambda pump speeds within 20 RPM and even then it would change as solder level dropped. Need thieving pads o
Electronics Forum | Tue Feb 23 11:09:12 EST 1999 | Steve Gregory
Hi Dave! Dat' be da same board we ran at NEPCON East in 97'! Ray Rua was running the TAC line then (his company usually runs the TAC line at almost all NEPCON shows). A couple of things I wanted to point out on that GIF image that might b
Electronics Forum | Wed Feb 12 16:23:30 EST 2003 | russ
I agree with DDave, You have something else wrong! .100 dips with .05" lead protrusion should not bridge (in fact I would think that it would be almost impossible). Tell us about your machine, (laminar flow, A-wave, etc.., size of nozzle, wave heig
Electronics Forum | Tue Jul 14 15:21:28 EDT 1998 | Brian Conner
| We are wave soldering a board having 24 similar thru hole connectors on it, using a wave soldering pallet. The problem is that one particular pin of connector in around 6-9 connectors get excess solder on the bottom side. I have tried all the par
