4949 through results

Electronics Forum: through (Page 1 of 495)

through hole today

Electronics Forum | Mon Sep 09 16:29:56 EDT 2013 | gregp

Hi Everyone, I'm looking for some feedback about through hole assembly requirements today vs. yesteryear. As I see it, there are two main categories...legacy through hole and new through hole with mixed technology. The legacy stuff is older designs

Data acquisition through USB

Electronics Forum | Thu Nov 19 23:43:22 EST 2015 | shruthils

Hello.. I am assigned to work on Data acquisition through FT232R USB UART IC. How the data can be received through the hyperterminal in the PC.

through hole today

Electronics Forum | Wed Sep 11 10:48:02 EDT 2013 | gregp

Hi Reese, The UIC machine is (was) good for higher volumes. Do you think these machines are less appropriate for smaller lot sizes and PCB's with just a few through hole parts? Also, are the UIC through hole machines still fully supported with ampl

through hole questions

Electronics Forum | Fri Nov 21 10:28:23 EST 2014 | gregp

Hi Adam, So with two to three people on the slide line, each only able to place five different components maximum, this means you generally don't exceed 10-15 through hole parts per assembly, correct? I am guessing these are mixed technology boards

through hole questions

Electronics Forum | Mon Nov 17 13:43:39 EST 2014 | gregp

So we all know through hole assembly hasn't been completely eradicated. I am doing some research as to the types of through hole assembly that still remain. My questions are related to through hole requirements and past, current and future methodol

through hole reflow

Electronics Forum | Tue Oct 01 12:23:26 EDT 2002 | barryg

We are looking at possible doing a few through hole components on the smt line. Is this feasable? What types of components are diffucult to do this way? What stencil considerations are there? Anyone have any info on this subject?

through hole solderability

Electronics Forum | Wed Feb 07 11:27:25 EST 2007 | asoe

I just wonder anyone had the idea of solderability test for through hole by using a wetting balance equipment? I read the jstd002/003 however my feel is now our machine (metronelec st60) is not capable of this test?