Electronics Forum | Thu Dec 14 04:42:11 EST 2017 | jineshjpr
Can anybody suggest how can I achieve good solderability in convectional reflow oven If I reduced Convection Air Speed 80%. The whole purpose is to reduce 0402 LED tilting in the convectional reflow and the PCB having QFN with 60 to 120 sec soak, 30
Electronics Forum | Thu Dec 14 05:07:55 EST 2017 | tsvetan
picture of the problem would help people to speculate what you do wrong
Electronics Forum | Thu Dec 14 15:05:17 EST 2017 | emeto
I am pretty sure, you are looking into the wrong spot. Your paste is too much, or your part has very inconsistent narrow leads(that includes wrong pad design as well.)
Electronics Forum | Wed Dec 20 07:16:16 EST 2017 | stephendo
I agree with Evtimov. What he didn't point out is that the surface tension of the solder would vastly overwhelm any force from air flow.
Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan
Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha
Electronics Forum | Thu Feb 08 14:03:39 EST 2007 | dave
Hi All, What is the cause of BGA tilt ? I have a failed board and it seems to have approx 0.25 mm difference in height on one edge of the BGA to the other. It is notable under magnification. Is this caused by to much time above reflow temp or not
Electronics Forum | Thu Jan 28 10:28:59 EST 2010 | blnorman
2D with tilt will work. We have found opens on BGA balls with a 2D system tilted at the right angle.
Electronics Forum | Mon May 27 07:16:27 EDT 2013 | mskler
We have an LED 0603 package, We are using stencil of 5 Mil, Before Reflow placement is perfact but after reflow it tis found that there is more than 30% LED are tilt. Can the speed of Fan in Reflow can help or I have to reduce the PAD opening in Sten
Electronics Forum | Fri Nov 24 05:38:46 EST 2017 | jineshjpr
Can anybody suggest how to reduce 0402 LED tilting as I am using Convectional Reflow oven with 10 Heating zones and controlling the solder paste with 4.2 mills paste height
Electronics Forum | Mon Oct 26 19:35:23 EST 1998 | Wayne Bracy
| I'm trying to find a source for a tilt device for use when doing touch-up soldering. Employee needs to raise the board above standard bench height for better access to the board and for better posture. Angle of the tilt device should be adjustabl
