Ohm's law wristwatches, desk clocks and wall clocks for DC or AC applications, with unique resistor band color chart. Handy for any electronics professional, student or hobbyist.
Established in 1986, Parks Associates is a market research and consulting firm that studies emerging residential technologies. Parks Associates publishes a wide variety of industry reports, hosts several workshops and conferences annually.
New Equipment | Education/Training
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
Electronics Forum | Thu Jul 05 10:11:19 EDT 2007 | ck_the_flip
The variables to study: * Dwell Time * Contact Length * Conveyor Speed * Parallelism * Top-side Substrate Temperature Before wave * Solder Pot temperature All of these variables are inter-related (ie changing one variable will affect another)
Electronics Forum | Thu Jul 17 20:20:12 EDT 2008 | davef
Wave set-up DOE * Immersion depth [1/3 to 2/3 of board thickness] has the least impact of any variable in wave soldering. * Contact length the greatest impact. * Control flux density, time through preheaters, top side temperature as the board reaches
Used SMT Equipment | In-Circuit Testers
Agilent 53310A Modulation Domain Analyzer The Agilent 53310A Modulation Domain Analyzer is an easy-to-operate, affordable modulation domain analyzer with an intuitive data display that gives you a direct view of jitter or modulation. Parameters
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 53310A Modulation Domain Analyzer The Agilent 53310A Modulation Domain Analyzer is an easy-to-operate, affordable modulation domain analyzer with an intuitive data display that gives you a direct view of jitter or modulation. P
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2003-02-26 09:07:20.0
Investments by electronics manufacturing companies of millions of dollars in software products to manage and automate supply and demand quantification have not prevented margins of error from 50% to 100%
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Thu Apr 15 00:00:00 EDT 2021 - Thu Apr 15 00:00:00 EDT 2021 | ,
LA/OC Chapter Meeting and Technical Presentation: Manufacturing Simulation
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Career Center | South West, Texas USA | Engineering,Management,Production
DESCRIPTION Growing and financially secure international manufacturing company is looking for a process or industrial engineer who is committed to developing and implementing lean practices, cell manufacturing, kanbans, and being a world class manuf
Career Center | Clarksburg, Maryland USA | Engineering,Production,Quality Control
Thales Communications, Inc. is currently seeking a hands-on Manufacturing Process Engineer to support electro-mechanical manufacturing in our Clarksburg, MD facility. The candidate must be driven with a strong ability to multi-task under pressure.
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology SMTnet Express June 27, 2012, Subscribers: 25268, Members: Companies: 8896, Users: 33235 A Study of PCB Insertion Loss Variation in Manufacturing Using a New
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/info-center/news/powder-coating-case-study-hunter-engineering
Coating Case Study - Hunter Engineering Powder Coating Case Study - Hunter Engineering 2019-09-04 Hunter Engineering decided it was time to make a considerable change to their powder coating equipment and
| http://etasmt.com:9060/te_news_bulletin/2021-09-02/24962.chtml
I.C.T REFLOW OVEN STUDY From: Author: Publish time:2021-09-02 10:34 Clicks:3 I.C.T is a manufacturer of SMT machines. It mainly provides customers with SMT production lines
