Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and
New Equipment | Test Equipment
Auto-SIR – Performs Surface Insulation Resistance testing in accordance with all major international standards: IEC 61189-5, ISO 9455-17, IPC-TM-650, BELCORE GR-78-CORE, DIN German & JIS Japanese standards. Includes elements of ANSI/IPC-JSTD001C (as
STI offers a variety of electrical test services from component-level testing/characterization to system-level testing. Electrical testing is offered to validate values in accordance with component manufacturer's performance specifications, a custom
New Equipment | Test Equipment
AutoCAF™ is able to measure up to 256 individual measurement sites under conditions of high humidity and temperature in accordance with IPC-TM-650 2.6.25 Test Method & IPC 9691 CAF Test Users Guide. Conductive anodic filament (CAF) failure is copper
500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo
New Equipment | Test Equipment
Fast and accurate ionic contamination cleanliness testing. Dynamic testing of ionic contamination is a widely approved and followed standard. So, too, is the equipment that makes it possible - SCS Ionograph®. Available in different models, the SCS
Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,
Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,
New Equipment | Solder Materials
High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
