Electronics Forum: tm650 (Page 1 of 16)

IPC-TM-650

Electronics Forum | Jacob Lacourse |

Wed Jan 29 11:16:36 EST 2003

IPC-TM-650

Electronics Forum | Wed Jul 22 08:52:29 EDT 2009 | spitkis2

Can someone clarify whether IPC-TM-650 Test Method 2.6.27 (Thermal Stress, Convection Reflow Assembly Simultation) is required for all bare board fabricators? Or is this test method optional, depending on the type or class of boards being fabricated

West coast testing labs?

Electronics Forum | Thu Mar 22 11:23:23 EST 2001 | slthomas

Any recommendations? Looking for someone that's familiar (even intimate) with the IPC-TM-650 stuff.

Anyone who has experience on IPC-TM650 environment test 2.6.3.1

Electronics Forum | Wed Nov 12 21:07:47 EST 2003 | davef

Please email us.

Measure Adhesive Properties of Solder Paste

Electronics Forum | Tue Jan 06 04:37:21 EST 2009 | janz

Tack test - follow IPC standard TM650 #2.4.44. Regards Janz

IPC-TM-650, does it apply?

Electronics Forum | Fri Feb 07 19:30:52 EST 2014 | staylorebad

TM-650 specifies a 50mm (2in) length of tape to be used for the test. What about areas that are smaller than 50mm? For example component pads surrounded by open areas are much smaller than that as are vias. If they pull off using the tape test would

Ionic Contamination Tests

Electronics Forum | Tue Sep 25 17:42:11 EDT 2007 | gsala

your comments will be appreciated, please; IC tests have been performed on two kind of Raw PCBs (HASL) samples by adopting three different methods : First Sample (supllier A) - Omegameter 600 SMT, solvent=40�C: extratcing time 10 min result = 0.2

West coast testing labs?

Electronics Forum | Thu Mar 22 17:33:38 EST 2001 | davef

Steve, IPC TM-650 Test Methods Manual is a load. IPC TM-650 Test Methods Manual: Section 2.1 Visual Test Methods Section 2.2 Dimensional Test Methods Section 2.3 Chemical Test Methods Section 2.4 Mechanical Test Methods Section 2.5 Electrical Test M

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

IPC-TM-650

Electronics Forum | Sat Feb 01 09:01:14 EST 2003 | davef

It sounds like your board is "dome shaped", some call it "cupped". If so, this is more of a twist than a bow. Before moving on, if we receive a board that is so torqued that we can't figure-out how to measure it, we reject it. Go back to your TM-

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