New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Test Equipment
SAKI 2D AOI BF-10BT Board Size 50 x 50 - 250 x 330mm Board Thickness 0.6mm - 3.2mm Dimensions 850× 1405× 1130 Weight Approx. 420kg Product description: SAKI 2D AOI BF-10BT Offline simultaneous double-sided system SAKI 2D AOI BF
Electronics Forum | Mon Sep 21 01:57:55 EDT 2009 | kaz
Hello All, My first visit here. I own and operate a small Industrial & Consumer Electronics Service Shop. There is more and more modules with high density fine pitch SMDs that we cannot handle. We bought PACE ThermoFlow BGA SMD station with a bunch o
Electronics Forum | Tue May 29 05:00:41 EDT 2007 | lococost
Grant, apart from troughput another thing to consider is boarddesign, If there is any SMD within a diameter (eg 3mm) of the connector you won't be able to solder them. I think those are the 2 main disadvantages of selective. That being said, for le
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2018-10-18 09:02:41.0
How to Solder a Surface Mount Device to a PCB Pad
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. Therefore, ensuring the quality of the soldered connection is critical to avoid this rework phase. On top of this, SMDs can detach under vibration, mechanical and thermal shock as they rely primarily on the solder connection for adhesion
