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Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles. The goal of lead restoration is not to mimic "l
Electronics Forum | Mon Jul 22 02:13:31 EDT 2019 | jandon
some PQFN package configurations have no toe exposed or do not have a continous solderable surface on the exposed toe and a toe fillet will not form. (IPC-A-610F 8.3.13)
Electronics Forum | Thu Jan 08 13:47:13 EST 2004 | guest
It is my understanding that per IPC specs toe fillets are not required as they do not add any strength to a solder connection. Our thoughts were allways that proper toe fillets are a sign of a good process. What are some of your guidelines and though
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
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AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
: Nitrogen Temperature:240°C Excellent Wetting in Toe and Heel – Small, Acceptable Voids Cross Section of QFP Solder Fillet PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 16 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 8 Material
