Technical Library | 2019-06-21 10:39:15.0
Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.
Technical Library | 2020-04-01 14:24:56.0
It happens much too often; manufacturing engineers are brought into a NEW product design phase at the very end of a design and are asked to provide input that should have been provided much earlier. One needs to understand how the circuit board design and quality of the manufacturing process not only effects assembly yield and product reliability, but how it could also affect the results of any testing that is done to circuit packs during prototyping. It is important that any circuit pack (including prototypes) that will be used in reliability, performance and functional testing be designed with the proper features and assembled with a manufacturing process that has been developed to produce a high-quality assembly. If not, the results of any testing might not represent the actual characteristics of the design and provide miss-guidance to future changes.
Technical Library | 2022-07-11 09:24:48.0
The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.
Technical Library | 2023-09-23 22:25:12.0
Moisture trapped within components and PBs presents a serious problem during the fabrication and assembly process. Too much moisture can lead to board failures when it is turned to steam during the reflow process.
Technical Library | 2023-09-23 22:29:02.0
Moisture trapped within components and PBs presents a serious problem during the fabrication and assembly process. Too much moisture can lead to board failures when it is turned to steam during the reflow process.
Technical Library | 2019-04-30 08:04:19.0
Every industry has every unwritten rules, like IC shipping tube moq is high in packaging tube industry rules! This regulation is not to be difficult for customers, but the cost of the problem, as long as the manufacturers feel that even a small amount of packaging tube can do and do too.
Technical Library | 2010-08-26 21:06:17.0
Driven by high-profile regulations compliance like the TREAD Act, warranty management has become a hot topic across industries worldwide. Recalls are costly and time-consuming events that should be avoided entirely. But without adequate process traceability and product genealogy, too many customers will get defective products and too many products will be recalled for repair or replacement even though they are not defective. Both scenarios have enormous implications for the quality-conscious manufacturer that gets rated on the number of recalls it performs - not to mention the enormous direct costs. The core issue is visibility into product quality.
Technical Library | 2005-05-16 12:09:02.0
Low cost techniques for building prototype and low volume SMT printed circuit boards.
Technical Library | 2021-07-28 18:35:13.0
The performance of electronic components is compromised by factors such as bubbles in the potting medium. Increasing numbers of applications – particularly in the automotive and electronics industries – therefore require completely bubble-free dispensing methods. This is where potting in a vacuum comes into focus. The widespread school of thought about this technology is that it is too complicated, too expensive and too slow. But a closer look shows that this view is incorrect. This is a mastered technology. As for costs, the calculation basis is key, since usually the potting and vacuum method is only considered after the required potting quality cannot be achieved reliably any other way. Under total cost of ownership assessments, higher system costs no longer play a key role, since component failure would result in much higher subsequent costs. And now there are proven solutions for high production volumes and/or shorter cycle times. This whitepaper explains when potting in a vacuum is ideal for your projects and what to be aware of.
Technical Library | 2015-07-21 13:50:37.0
Achieving an even coat at the right desired thickness is a major challenge when it comes to applying conformal coating to a Printed Circuit Board (PCB). Applying a coating too thin will ultimately render the electronic assembly vulnerable to potential environmental risks therefore defeating the purpose of the coating. Apply the coat too thick, and it could leave the electronic specific components non-functional therefore destroying the electronic assembly entirely. Coating thickness must meet quality specifications. Measurements for coating thickness may be taken while film is dry or wet. Once measurements are recorded, thickness is compared to quality specifications and fluid dispensing automation machinery is calibrated as necessary. There are a handful of methods for measuring conformal coating thickness that are commonly used in the Electronic Manufacturing Services (EMS) and Original Electronic Manufacturer (OEM) industries. A few commonly used methods for checking conformal coating thickness include:
