Technical Library: tpsys and 1.5.15 (Page 1 of 1)

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Technical Library | 2009-04-30 18:06:24.0

This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.

i3 Electronics

  1  

tpsys and 1.5.15 searches for Companies, Equipment, Machines, Suppliers & Information

Reflow Oven

High Throughput Reflow Oven


ONLINE IPC Training & Certification
Pick and Place

High Speed Precision In-Line SPI System - Mirtec MS-11