TR7600XLL SII CT is high performance and high speed 3D AXI for the largest server, networking and power PCBs. The TR7600XLL SII system uses TRI's unique shadow-free technology to inspect multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs and Press-f
The TR7600F3D presents a next-generation inspection platform for the most demanding PCB design. The inline CT AXI solution combines ultra-high resolution imaging with high definition planar CT inspection, a new robust hardware platform, and a redesig
TR7700 SII Plus CI brings easy Conformal Coating Inspection that combines a high precision optical design with specialized multi-phase lighting to inspect UV-active Conformal Coatings. Smart software and multi-phase imaging ensure the TR7700 SII Plus
TR7600XM SII and TR7600XLL SII are high performance and high speed 3D AXI for the largest server, networking and power PCBs. The TR7600XM SII and TR7600XLL SII systems use TRI's unique shadow-free technology to inspect multi-layer boards with 2/3-lay
New Equipment | Test Equipment - Bond Testers
The TR8100H SII is the latest ICT with High Throughput and High Accuracy for large and complex PCBAs. The TR8100H SII is the top-of-the-line board test system targeting the low-voltage testing market. TR8100H SII's vacuum fixture system ensures full
Utilizing a new hybrid inspection design, the TR7700 SII Plus can leverage both stop-and-go strategy and dynamic imaging to achieve optimal inspection performance on all types of PCBAs, e.g.: Inspection Cycle Time Reduction. Simply switch the inspect
The TR7700QB SII is the bottom-view 3D AOI solution with 15 µm high resolution 12 MP imaging capable of metrology-grade inspection. The TR7700QB SII is designed for high coverage inspection for Through-hole technology components and dual in-line pack
The TR7700Q SII is powered by TRI's Smart Programming with auto-learning functionalities, flexible inspection algorithms, and metrology capabilities for exact measurements and data exchange for Smart Factory applications. The advanced mechanical stab
The TR7007 SII Ultra performs at an industry-leading speed of up to 180 cm2/sec. The TR7007 SII Ultra is built on an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The 3D SPI is an Industry 4.0 Rea
The TR7700QM SII is built on a high accuracy platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI can inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart
