New SMT Equipment: transition and temperature and gp0-2 (2)

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

SuperM.O.L.E.® Gold 2  Flux and Wave Solder Thermal Profilers

SuperM.O.L.E.® Gold 2 Flux and Wave Solder Thermal Profilers

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

Electronics Forum: transition and temperature and gp0-2 (5)

Td and Tg

Electronics Forum | Wed Aug 27 13:08:30 EDT 2008 | vladig

Td - is the degradation temperature for a laminate (board), while Tg - is glass transition one. There is one more (even more important) - delta Tg. They characterize the quality of the laminate material. Regards, Vlad www.sentec.ca

Your opinion about RoHS and WEEE ?

Electronics Forum | Wed Dec 15 16:38:42 EST 2004 | patrickbruneel

Here's my 10 cents Studies done in the 1980's concluded that pure tin was prone to whisker generation. A tin content lower then 70% became exempt from this phenomenon. I have never seen or done any studies on the impact lead had in reducing the pote

Industry News: transition and temperature and gp0-2 (46)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Technical Library: transition and temperature and gp0-2 (4)

Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints

Technical Library | 2014-06-19 18:13:23.0

For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...

National Chiao Tung University

Coatings and Pottings: A Critical Update

Technical Library | 2021-08-11 01:00:37.0

Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.

DfR Solutions (acquired by ANSYS Inc)

Express Newsletter: transition and temperature and gp0-2 (267)

SMTnet Express - August 26, 2021

SMTnet Express, August 26, 2021, Subscribers: 26,759, Companies: 11,431, Users: 26,816 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding

Partner Websites: transition and temperature and gp0-2 (14337)

Printek II Semi Automatic Stencil Printer Transition Automation Nice!

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_printekII_screen_printer.html

Printek II Semi Automatic Stencil Printer Transition Automation Nice!   Transition Automation Printek II      Model Number: Printek II Serial Number: 4262012 Type: Semi-Automatic 2 Camera Stencil Alignment TSA Vision Shuttle Table from Left to Right Edge Rail and Vacuum Tooling Includes Squeegee Holders and Blades 110 Volts

1st Place Machinery Inc.


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