Electronics Forum | Thu Jan 20 16:06:38 EST 2000 | Mike Naddra
Regarding glass transition , does anyone have expierance glass wiht transition temperature specification , such as what are the detrimental effects of exceeding the Tg , how long over the glass transition temperature ,if any , is acceptable. Tg of di
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Tue Dec 19 07:58:29 EST 2006 | ccgooi
Our company is assembly flip chip on flex, we have new design of flip chip which die temperature will increase until 145 degree C after test run the end product, however the Tg,glass transition temperature is 148. Will this case causing any reliabil
Electronics Forum | Fri Apr 24 14:34:14 EDT 1998 | Ed Holton
Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time Your help is appreciated Ed Holton Hella E
Electronics Forum | Fri Apr 24 15:21:08 EDT 1998 | Earl Moon
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
Electronics Forum | Fri Apr 24 20:33:06 EDT 1998 | D.Lange
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
Electronics Forum | Tue Aug 25 16:28:11 EDT 1998 | Al Knudson
Hello, Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal expan
Electronics Forum | Mon Jul 01 17:22:27 EDT 2002 | Daan Terstegge
Tg = glass transition temperature, the temperature at which the glass-epoxy starts losing it's properties as a solid material. daan
Electronics Forum | Mon Nov 13 13:15:51 EST 2006 | CK the Flip
Tg, by definition is the glass transition temperature for materials. It's the temperature where your board goes from rigid to "rubbery". Not sure if a higher Tg would help prevent delam. One of the PCB experts of the forum might know this.
Electronics Forum | Wed May 15 16:18:58 EDT 2019 | stephendo
Look up the glass transition temperature (Tg) for the PCB material. If you get the PCB above this temperature it will become quite soft. If it is a populated board remember to take any moisture sensitive devices on it into consideration.
