Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Industry News | 2012-08-09 18:20:49.0
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on August 23, 2012 from 9:00 am until 3:00 pm.
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2014-02-11 15:25:57.0
Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.
Industry News | 2013-12-18 15:18:53.0
Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.
Industry News | 2005-08-22 18:40:30.0
Indium Corporation�s Vice President of Technology, Dr. Ning-Cheng Lee, is featured on the cover of Electronics Manufacturing CHINA (EM China), the leading Chinese technical publication for the electronics manufacturing industry in China.
Industry News | 2012-05-31 14:49:02.0
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
Industry News | 2020-05-12 11:49:03.0
Indium Corporation's Claire Hotvedt, Product Development Specialist, will host two InSIDER Series webinars focused on the company's innovative low-temperature solder offering on May 12 at 2 p.m. and May 13 at 8 a.m. EST.
Industry News | 2009-04-09 20:18:51.0
ECD is proud to announce the release of the newest resource for it's customers. ECD Thermosphere will be covering topics from thermocouple attachment to "Wavy Profiles"
Industry News | 2009-04-13 15:02:37.0
ECD introduced its thermal quality management program, called ThQM, for OEMs and their volume manufacturers. It is designed to directly address the dialog required between OEMs and contract assemblers, including OEM requirements, machine recipe development, and thermal profile verification.
