Technical Library | 2019-06-18 10:18:00.0
ACI Technologies is tasked with decapsulation of electronics components for testing and investigative purposes. In the normal method of decapsulation, an analyst will drill a small indentation, with a rotary tool, in the hermetic sealant material and then apply Nitric acid to eat through the polymeric encapsulant.
Technical Library | 2010-11-24 20:47:38.0
As the electronics manufacturing and assembly industry in the US recovers to some degree from the economic crisis which began in 2008, the challenge of component shortages has risen to the top as one of the stumbling blocks for contract assemblers and cap
Technical Library | 2020-09-19 04:13:27.0
Wistron: New way to count SMT electronic components Wistron (Zhongshan) Co., Ltd.: Wistron Information Technology Co., Ltd. was established in 1998, and its predecessor was the R&D service organization of Acer Computer Co., Ltd. As one of the world's largest ODM (Original Design and Manufacturing) companies, Wistron is committed to becoming an industry benchmark company in the field of professional foundry. It has six manufacturing bases, eight regional service centers and three R&D and design centers around the world. The company is headquartered in Taiwan, and its branches and operating points are in China, Japan, the Philippines, the United States, the Netherlands, the Czech Republic, Malaysia, Mexico, etc. country. Wistron Information Technology (Zhongshan) Co., Ltd. is located in the Torch Development Zone, Zhongshan City, Guangdong Province. It has about 17,000 employees. Such a large number of personnel also brings certain management difficulties to the enterprise, especially the epidemic in 2020, which will cause many The return of migrant workers brings many obstacles, such as traffic obstacles and isolated observation, which bring inconvenience to the normal employment of employees, and the development of the company cannot be stopped, which also causes the company to use alternative means to compensate for the impact of the lack of personnel on the company. Technology is the primary productive force. Undoubtedly, how to reasonably use technology to replace labor. One machine can cover 6-7 workers to achieve technological development. Wistron InfoCom has introduced X-RAY SMD component reel counter to increase storage investment Strengthen, reduce the number of warehouse personnel, and realize personnel management and cost control from the source. X-RAY counting machine is a professional counting machine for electronic component materials such as SMT. It does not need to be disassembled and packaged. You only need to place the material tray in the waiting area of the tray, and the equipment will automatically enter the counting mode after starting the X-RAY switch. , It takes about 10~18 seconds to get the inventory result, and count 4 reel each time. X1000 Fastest SMD Reel Counter advantages: ● X-ray tube adopts American VJ sealed X-ray tube, long life and maintenance-free ● 17-inch ultra-clear flat panel detector, fast imaging and no distortion ● Calculate 4pcs 7-inch material trays or 1pc 17-inch material tray at the same time ● There is no need to spend 3-5 days to input data to the material tray in the factory, users can use it directly ●Algorithm/database is permanently updated and supported for free ● Significantly reduce the time for counting, eliminate redundant manpower, and help other personnel to take up or change the line to shorten the line change and stop time ● The smart point machine uses digital data, which can print barcode stickers or upload directly to the database. The traditional way of counting equipment must be one for each operator, which takes up a lot of space. The counting results are still filled in manually, and there may be errors or omissions ● The smart counting machine can greatly improve the lack of material, lost material, leaking, and under-material conditions, digitally manage material storage, reduce material inventory costs, and improve material inventory accuracy ● Meet the trend of Industry 4.0, SMT production line, smart, less human, and efficient ● No need to open the packaging bag, maintain the integrity of the material roll, and will not affect the moisture resistance of the material Family of Industrial X-ray inspection machine & BGA rework station Last Article: Seamark ZM EeIE 2019 Next Article: Seamark ZM NEPCON Shenzhen China 2019 TSI Mexico use Seamark x ray machine Seamark ZM Productronica & NEPCON China Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Technical Library | 2020-08-05 03:42:00.0
Sansui Electric X ray Component Counter Sansui Electric Co., Ltd. is one of the world's oldest and largest audio-visual companies. Sansui Electric products have been fully involved in various fields, including notebook computers, air conditioners, traditional TVs, DVDs, and top electronic technology LEDs and LCDs. Why need Sansui Electric X ray Component Counter? The growth of the production line requires a large number of staff in the warehousing department to manage and control electronic materials, to realize timely inventory and update of material data, to prevent the lack of materials and the management and control of stagnant materials, and to provide more data for enterprise production. Basis, reduce costs. Advantage of Sansui Electric X ray Component Counter? Sansui Electric purchased the X ray component counter X7600 ( X1000 upgrade to X7600), which realized fast counting for Sansui Electric. Sansui Electric X ray Component Counter images X ray SMD counter can be used for 7-17inch Tape Reel/JEDEC Tray/IC moisture sensitive package. The speed can reach 7-12s/4 reels, and the accuracy can be as high as 99.9%. X ray counter can be connected to Sansui Electric's ERP system, and ERP can automatically Update the data so that the relevant personnel of the purchasing department and the production department can see the relevant data in a timely and effective manner, and make a production plan. Sansui Electric X ray Component Counter Youtube: https://youtu.be/gfXMi7MsZRU Hope Seamark ZM X ray SMD counter can help more " Sansui", and reach automatic warehouse management. let we let get Sansui Electric X ray Component Counter! Family of Industrial X-ray inspection machine & BGA rework station Last Article: Foxconn x ray Next Article: BYD Electronics Xray 6600 TSI Mexico use Seamark x ray machine TDK Navitasys India X Ray case Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process 日本山水电气株式会社是全世界历史最悠久、规模最大的影音企业之一。 Sansui Electric产品已经全面涉及到各个领域，包括了笔记本电脑，空调，传统技术的电视，DVD,和顶尖电子技术的LED和LCD. 生产线的壮大，仓储部门需要大量的工作人员进行对电子物料的管控，实现及时的物料数据的清点和更新，以防止物料缺少，滞料的管控，以此更大化地为企业生产成本提供更多的数据依据。 Sansui Electric 采购了X ray component counter, 为Sansui Electric解决了快速counting,速度可以达到7-12s/4 reels,精准度可以高达99.9%，X ray counter可以和Sansui Electric 的ERP系统相连，实现自动更新数据的目的，让采购部，生产部等相关人员都能够及时有效的看到相关数据，做好产能计划。
Technical Library | 1999-04-15 08:21:22.0
Intel's Packaging Databook is intended to serve as a data reference for engineering design, as well as a guide to Intel package selection and availability. IC assembly, performance characteristics, physical constants, detailed discussions of SMT, etc.
Technical Library | 2015-08-17 09:07:11.0
Since a high percentage of product failures can be traced to poor electrical connections, crimp quality is of paramount importance. There are many factors that come into play that affect crimp quality and knowing the relevant factors, and to what extent each factor affects the end result, will help to guide the process engineer towards achieving the best possible results.
Technical Library | 2009-12-14 20:27:54.0
Solder paste is the most recognized form of solder used in electronics assembly today. A surface mount application depends on solder paste to attach the components to the circuit board. However, solder paste may not be the only solution. This is especially true when working with through-hole components or very large devices that require more solder than can be supplied by printed solder paste. In fact, quite often a PCB involves mixed technology that requires more than one form of solder. Solder paste is used for the surface mount components and solder preforms are utilized to attach the leads on through-hole components, avoiding wave or selective soldering.