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LONOX® L5611 is a solvent-based cleaner for misprinted boards and stencils. It is effective on a wide variety of flux, solder paste and uncured adhesives. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature t
Electronics Forum | Fri Dec 09 00:19:51 EST 2016 | aqueous
Hi Dean, We are a manufacturer of cleaning equipment. I'm not sure if your machine is one of ours or another brand. Regardless, I am happy to provide assistance. In order to maximize the level of "helpfulness", it would be helpful for me to know mor
Industry News | 2013-06-24 17:06:39.0
ZESTRON, is pleased to announce that Jigar Patel, M.S.Chem.Eng., Senior Process Engineer, ZESTRON, will present “Determine Critical Cleaning Process Parameters for QFNs” at the SMTA Upper Midwest Expo and Tech Forum on June 27th.
Industry News | 2013-08-30 07:18:24.0
ZESTRON is pleased to announce that Kalyan Nukala, M.S.Chem.Eng., Application Engineer, ZESTRON, will present “Determine Critical Cleaning Process Parameters for QFNs” at the SMTA Capital Expo and Tech Forum on September 10th.
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
Technical Library | 2019-07-17 17:56:34.0
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface. In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented.
ATRON® SP 200 is an aqueous-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets and condensation traps. ATRON® SP 200 can be used for the removal of unsoldered solder pastes from SMT stencils. The cleaner
cycles Main pump, sump pump, primary drain, and secondary drain 208 Volts 50 Amps 60 Hertz 1 Phase Good Condition Location: MA Price: $12,500 Aqueous Technologies PCB Batch Cleaner See more photos below
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