Electronics Forum: un-solders (7)

green stick test

Electronics Forum | Fri Apr 29 11:21:35 EDT 2005 | jsloot

I have heard the term as both green stick and orange stick, but yes, pushing on the leads to detect un soldered leads. The amount of force is subjective. Any thoughts on this is appreciated.

Conventional Hand Assembly

Electronics Forum | Mon Oct 14 10:21:07 EDT 2013 | h9176

We have for a time been collecting data, but unfortunately don't use it. The issue we have is with mainly missing items being found at inspection or un-soldered joints not being spotted. I am wondering if anyone else in the same situation and NOT us

Technical Library: un-solders (2)

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

Technical Library | 2020-05-07 03:46:27.0

The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.

Nordson SELECT

Defect freeQFN Assembly

Technical Library | 2011-06-09 20:28:30.0

QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and

AccuSpec Electronics, LLC

Express Newsletter: un-solders (1)

Defect Free QFN Assembly

bridging or un-solders. These defects are hard to detec

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