Industry Directory | Manufacturer
Additive modifies bare PCBs by adding solid copper traces, SMT Pads and deletes even under BGAs. RoHS / non-RoHS bare boards when engineering changes are needed and re-design is not done. Improve quality, thru-put and reliabilty while lowering cost.
Industry Directory | Consultant / Service Provider
Lead Conditioning, Lead Scanning, Tape & Reel, Lead Tinning, Bake & Dry-Pack, BGA Reballing Services
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
► Exclusive 15MP CoaXPress Camera System ► Dual Projection Shadow Free Moiré Technology ► Precision Compound Telecentric Camera Lens ► Automated Z-Height Calibration System ► Automated PCB Under Board Support System ► Precision PCB Warpag
Electronics Forum | Sat Nov 08 08:16:45 EST 2003 | davef
We saw this quite a bit, I want to say 5 or 6 years ago, but it's probably more like 10 years ago. It's caused by poor solder mask crue. Talk to your board fabricator about solutions.
Electronics Forum | Fri Nov 07 12:48:31 EST 2003 | rholland
I have seen in the last couple of months more boards with a white hazing under the solder mask. I ran a few tests on a board to determine the cause of the white hazing underneath the solder mask. First I confirmed, or at least I think I confirmed, t
Used SMT Equipment | Screen Printers
DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling&n
Used SMT Equipment | Screen Printers
DEK Horizon 03iX SMT Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type Hawkeye 750 or Hawkeye 1700 (optional) 198040 198043 hawkeye Board foil clamp siz
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2011-12-14 16:19:46.0
MIRTEC announces that ACD purchased two Mv-7xi In-Line AOI Systems during the recent Productronica Trade Fair in Germany. ACD has very high inspection standards and the new MV-7xi AOI systems will help the company continue to meet or exceed those requirements.
Parts & Supplies | Circuit Board Assembly Products
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
Training Courses | ON DEMAND | | IPC-6012 Expert (CSE)
The IPC-6012 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-6012 standard.
Training Courses | ON DEMAND | | IPC-6012 Expert (CSE)
The IPC-6012 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-6012 standard.
Events Calendar | Tue Aug 18 00:00:00 EDT 2020 - Tue Aug 18 00:00:00 EDT 2020 | ,
How to Minimize Humidity Interaction with PCBAs for Robustness
Events Calendar | Wed Jul 26 00:00:00 EDT 2017 - Wed Jul 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Technical Education - Best Practices in Design
Career Center | Chicago, Illinois USA | Sales/Marketing
My client has 2 sales rep positions available right now! Energetic, Highly motivated, Salesperson (Hunter) to sell ACDI design services, PCB Boards. (Go to website under services offered to see what products they would have to sell) Person woul
Career Center | Burnet, Texas USA | Sales/Marketing
Austin American Technology is seeking Independent Manufacturers Representation for our Arizona and New Mexico territory. AAT is looking for a representative organization with complementary lines of capital equipment that would like to add the world
Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production
Experience in handling Process related issues throughout the Product Manufacturability. Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData Programming and maintenance of Solder Paste Printer of DEK
Career Center | madak, AP India | Engineering,Research and Development,Technical Support
i have zero experience.
SMTnet Express, June 7, 2018, Subscribers: 31,097, Companies: 10,956, Users: 24,801 Potting Under Vacuum or Atmosphere? Scheugenpflug; Scheugenpflug Inc. Potting under vacuum or atmospheric conditions? This question about the correct procedure
SMTnet Express, October 23, 2014, Subscribers: 23438, Members: Companies: 14072, Users: 37000 Combination of Spray and Soak Improves Cleaning under Bottom Terminations. Dr. Mike Bixenman; Kyzen Corporation , Julie Fields; Technical Devices Company
Heller Industries Inc. | https://hellerindustries.com/parts/591823/
591823 - Manual Hard Copy, 1900 (Oven under warranty) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/trim-pad-under-component-feature_topic574_post2749.html
Trim Pad Under Component Feature - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Trim Pad Under Component Feature
