Microwave Plasma System for assembly cleaning prior to wirebond, attach, encapsulation, and underfill.
Industry Directory | Manufacturer
Preco, Inc. is a premier system and manufacturing service provider for laser processing, die cutting and screen printing. It also offers reworkable underfill product that can be processed and reflowed under normal surface mount soldering assembly.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Electronics Forum | Mon Apr 01 20:33:30 EST 2002 | davef
Regarding your underfil ... * What material did you use as an underfil? * What machine and technique did you use to apply the underfil? * What type of component were you underfilling? * What was the end-use environment?
Electronics Forum | Mon Mar 29 14:29:50 EST 2004 | davef
Few people underfill PBGA. People underfill CCGA, uBGA, and FC. Consider a reworkable underfill on those devices that you expect to rework. Reworkable underfill candidates * Thermoset: ME526 (Red) * Loctite: 3567 (Cream) * Dexter: FP 4511 (Black)
Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale We have (2) identical systems available..... Both in very good running condition and can be inspected under power..... See attached pictu
Used SMT Equipment | Adhesive Dispensers
Speedline Technologies Camalot FXD Underfill Dispensing System with Smart Stream Technology For Sale We have (2) identical systems available..... Both can be inspected under power..... Equipment Description Camalot FX-D Model: 8000-1 Year 5/
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2011-09-12 12:04:25.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics
Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Events Calendar | Mon Apr 06 00:00:00 EDT 2020 - Mon Apr 06 00:00:00 EDT 2020 | ,
Reflow Simulation – X-ray & Optical Help Solves Design & Process
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | San Jose, California USA | Research and Development
Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMTnet Express, April 17, 2014, Subscribers: 22675, Members: Companies: 13858, Users: 36080 A Novel Low Temperature Fast Flow And Fast Cure Reworkable Underfill Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. In order to meet
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