Our most advanced dispensing platform for electronics manufacturing The Vantage® Series is specifically designed for high-end advanced semiconductor package, electromechanical, and printed circuit board assembly. Create an unparalleled dispensing p
New Equipment | Coating Equipment
The Select Coat Applicator Series – which includes the SC-350 Select Spray and the SC-300 Multi-Mode – is a highly-versatile conformal coating applicator that supports a wide range of fluid viscosities and is ideal for solvent or solvent-less fluid f
Electronics Forum | Thu Sep 05 23:18:03 EDT 2013 | feiyangniao
There is a new toy I received today: a NeoDen TM-240A automatic desktop pick and place machine! I’ve kept my eyes on this baby for a quite a while, and finally decided to make a purchase last week. The shipping was very fast: DHL from China, a total
Electronics Forum | Fri Jan 30 14:20:55 EST 2009 | scottp
I do a lot of thermal cycle testing of new components for my company and often when I lay out a test board I'm trying to simulate 4 or 6 layer boards but I don't need them for routing so I just use a solid fill of a cross-hatch pattern. I've done it
Industry News | 2003-04-11 08:53:18.0
This agreement establishes PCS as the exclusive representative of RSI in the UK and the Republic of Ireland.
Industry News | 2003-02-13 08:11:45.0
eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
epoxy resin meter mix and dispensing machine for Current and Voltage Sensors Whatsapp +86 134 2516 4065 Model: PGB-200 PGB-200-800 system accurately meters, mixes and dispenses two-compon
About the machine please contact whatsapp 0086 134 2516 4065 D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric enviro
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Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Achieving SMT Compatible Flip Chip Assembly
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page Book Review by Brian Ellis Title: An Engineer's Handbook of Encapsulation and Underfill Technology Author
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
. Our NCM5000 Jetting Pump and our innovative Progress Cavity Displacement (PCD) are two of these pumps. A jetting pump has the advantage of dispensing small droplets from up to 4 mm above the surface while maintaining a small wet out area
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
. Precise, consistent, and advanced UPH results are paramount. Wafer-Level Packaging (WLP) generally encompasses different integration approaches that require underfill, such as fan-in/fan-out, chip-first/chip-last, and a range of other packaging types
