Electronics Forum | Thu Jul 20 16:15:24 EDT 2000 | Bob Willis
Sorry at the moment I do not have information but as usual I want to get some hands on sessions going. We were doing a flip chip workshop hands on session for Speedline last week in England. We did the theory and then hands on soldering and underfill
Electronics Forum | Fri Jan 30 14:20:55 EST 2009 | scottp
I do a lot of thermal cycle testing of new components for my company and often when I lay out a test board I'm trying to simulate 4 or 6 layer boards but I don't need them for routing so I just use a solid fill of a cross-hatch pattern. I've done it
Industry News | 2013-10-22 15:39:58.0
Speedprint Technology will present the award-winning SP710avi and SP210avi Screen Printers in Hall A2, Booth #439 at the productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2022-04-28 14:30:28.0
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will highlight an array of award-winning inspection and measurement solutions at SMTconnnect in booth 4.A-233 on the NürnbergMesse event grounds during 10-12 May 2022. The following is just a glimpse into what Koh Young will have in store for our visitors at the tradeshow:
Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Achieving SMT Compatible Flip Chip Assembly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
Underfill Volume and Tolerance Calculator Download this handy tool to calculate the target dispense volume for your chip dimensions. Underfill ASYMTEK automated dispensing systems lead the industry to meet dispense accuracy, precision, and throughput challenges
Heller Industries Inc. | https://hellerindustries.com/thermal/
. Improving curing productivity with a family of in-line vertical ovens for users of die attach, flip chip underfill and COB encapsulation applications
.gif)
