Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Fri Aug 23 12:35:09 EDT 2002 | msjohnston
Has anyone done a study or know of one that addresses the flow / no-flow underfill differences for CSP devices. My main interest is in the reliability of the CSP and underfill. Any help would be great. Thanks, Mike
Electronics Forum | Fri Aug 23 18:51:00 EDT 2002 | edahi
weve done a few evaluations for the no-flow underfill and for the reliability I think it has already passed MRT L3 @ 220C reflow. What is it specifically you're interested about the flow u/fill??
Electronics Forum | Thu Apr 01 22:59:00 EST 1999 | jackie hsieh
dear all: we use the HCFC,manufactored by 3M,for the ultrasonic stencil cleaner.but it's too expensive to us. I think is it possible to use no-volatility liquid for the ultrasonic stencil cleaner? or other solvent? thank for your help jackie hsieh
Electronics Forum | Mon Apr 05 12:36:53 EDT 1999 | Jim Muckle
Jackie: We ran into some pretty ineresting guys at the Nepcon show who specialize in this area. It may be that they have a solution for you. Company name was Zestron, and the guy I spoke with was Andreas. Seemed very knowledgeable, and was very pl
Electronics Forum | Tue Apr 06 17:01:35 EDT 1999 | Bill Wilson
JNJ Industries just came out with some real cool new chemistries for Ultrasonics at Nepcon called Aquasonic. You can contact them for info at 800-554-9994 | dear all: | we use the HCFC,manufactored by 3M,for the ultrasonic stencil cleaner.but it's t
Electronics Forum | Mon Apr 05 20:24:21 EDT 1999 | jackie hsieh
dear jim, At first, thanks for your kindly help! Could you tell me the e-mail address of Andreas ? thanks again have a nice day! | Jackie: | | We ran into some pretty ineresting guys at the Nepcon show who specialize in this area. It may be that t
Electronics Forum | Tue Apr 06 13:11:22 EDT 1999 | Mike Konrad
I would recommend the following chemistries: Zestron Vigon SC200... Good but very $$$$ (703) 589-1198 Vertex (sold by Petrofirm and Alpha Metals)... Won't last as long as Zestron but must less $$$ (904) 261-8286 Kyzen... Also very good (800) 84
Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo
No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux
Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef
Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.
