DA 90 is a silver filled, high thermal conductive, solvent-free and fast curing thermosetting die attach adhesives. DA 90 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. It can be applied using dis
Electronics Forum | Tue Nov 08 20:20:32 EST 2005 | davef
Necessary tools are: * Chisel * Ball peen hammer After you buy two new nozzles, keep one in a baby food jar filled with your underfill suppliers recommended solvent for half the shift. At the break, swap the dirty nozzle on the machine with the cle
Electronics Forum | Tue Nov 08 04:11:34 EST 2005 | Eric C
I am trying to find out if there is any solvent for underfill material that has hardened/cured. Regular/routine maintenance of our dispenser units requires thorough cleaning oftentimes scraping is done for material that has hardened. Any inputs would
Industry News | 2017-01-26 19:53:00.0
GPD Global will exhibit in Booth 2933 at the upcoming IPC APEX EXPO 2017 scheduled to take place February14-16, San Diego Convention Center. GPD Global will officially launch its new, fully automated dispense platform, Hyperion, and a new, low cost conformal coating system.
Industry News | 2012-11-08 12:01:36.0
Kyzen, will present papers at SMTA Penang Tabletop Exhibition, scheduled to take place November 16, 2012 at the Eastin Hotel Penang, Malaysia.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/underfilling?con=t&page=38
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