New SMT Equipment: underfill solvent (Page 1 of 1)

DA 90 Die Attach Adhesive

DA 90 Die Attach Adhesive

New Equipment | Materials

DA 90 is a silver filled, high thermal conductive, solvent-free and fast curing thermosetting die attach adhesives. DA 90 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. It can be applied using dis

YINCAE Advanced Materials, LLC.

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World's Best Reflow Oven Customizable for Unique Applications