#1 Stop for all of your Universal Instruments Pick and Place needs Visit our Feeder Frenzy depot to load up on quality pre-owned feeders and feeder repairs~
Vibration monitoring instrumentation: portable vibration meters and analyzers, protection systems for fans and pumps, high-end online systems for auxiliary machinery (pomps, fans, motors, bearings, gears) To learn more please visit our website
Electronics Forum | Wed May 21 14:47:49 EDT 2003 | radney
On the new 4797 T12W8P feeders we are having trouble picking the very thin chip resistors. Adding foam to the feeder (beneath the pick point) helps, but it only minimizes our frustration. Universal has a reel of these parts and they are looking into
Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F
| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release
Used SMT Equipment | Conveyors
Make: Universal Model: 5326i Description: Conveyor Quantity: 9 Dropbox Link to additional photos: https://www.dropbox.com/sh/nqv1ir96ajyzsyi/AADVxqoxweToNOACXPnyg5Fta?dl=0 Make: Universal Model: 5362T Descrip
Used SMT Equipment | Pick and Place/Feeders
Universal Fuzion Pick and Place Machines 3 Units available Year 2014 Universal Fuzion 1-30 Single Beam FZ 30 spindle head Universal Fuzion XC2-37 1,300mm long board capability 2 beams FZ30 and FZ7 Head Universal Fuzion 2-37 2 Beams F
Industry News | 2003-03-04 08:31:59.0
Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market
Industry News | 2014-02-18 17:01:34.0
The SMTA is pleased to announce the program for the 2014 International Conference on Soldering and Reliability being held May 13-15 in Toronto, Ontario, Canada.
Parts & Supplies | SMT Equipment
QUALITY OEM UNIVEERSAL SMT NOZZLES Full series are available,few are listed below: Machine Des: Nozzle,Universal GSM, Flex, Inline 4 SMT Nozzle P/N: 45466938 Des: Nozzle,0.080 Inch O/D with 5 hole multiport P/N: 45466936 Des: Nozzle,0.1
Parts & Supplies | Component Packaging
Universal AI Parts chain clip 5.0MM and 7.5MM 42804703 chain clip 5.0MM 48820001 chain clip 7.5MM zoey@jinchensmt.com
Technical Library | 2007-09-27 16:18:15.0
Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.
Technical Library | 2007-06-27 15:43:06.0
Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.
Make: Universal Model: Genesis GI-07S – 4992C (With PTF) Vintage: 2012 SW: UPS+ 8.3.0.10. Details: • Linear X/Y • 7 spindle head • Nozzle changer • Magellan 2.3 camera • PTF mounted on rear Visit www.lewis-clark.c
SUPPORT & NEWS Sales and Technical Service Packing and Shipping Latest News Download Catalogue CONTACT US Symor Instrument Equipment Co.,Ltd Email:Sales@climatechambers.com Tel: +86-551-63853683,68663633,663853681 Fax:+86-551-68663630 A
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials
Moeller - Kiel University Intermetallic co
