PCBA CLEANING MACHINE 5600 PCBA CLEANING MACHINE SMT CLEANING MACHINE Demensions:600 x 1000 x 1600mm PCB width:50-400mm PCB Length:Max 460mm Pitches:10,20,30mm Product description: PCBA CLEANING MACHINE 5600 INQUIRY PCBA CLEANING MAC
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Electronics Forum | Sat Jan 22 16:39:26 EST 2011 | eadthem
Your typical high mix line would consist of, Stencil printer, 1-2 foot conveyor belt, fast PNP machine (say a universal 30 spindle turret lightning head), 1-2 foot conveyor belt, large/heavy part PNP (say a universal flex jet 7 spindle or 4 Spindle),
Electronics Forum | Thu Jun 17 22:10:48 EDT 1999 | Earl Moon
Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? for example: Solder Bridge 1.verify amount of flux been aplied. 2.verify turbulance on
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2011-12-07 22:27:26.0
SWEMCO has purchased a Universal Instruments Genesis Platform production line. The new equipment set was complemented with Universal’s Dimensions® Line Manager shop floor control software. Both are now operational in SWEMCO’s Moorestown, New Jersey production facility.
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49889209 8mm High Performance DL-60 (Gold Plus) 49889210 8mm High Performance DL-60 (Gold Plus) 49889211 8mm High Performance DL-60 (Gold Plus) 49889212 8mm High Performance DL-60 (Gold Plus) 49889213 8mm High Performance DL-60 (Gold Plus) 49889
Technical Library | 2010-04-15 22:06:32.0
As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
SMTnet Express, April 16, 2015, Subscribers: 22,628, Members: Companies: 14,302, Users: 38,055 Stereo Vision Based Automated Solder Ball Height Detection Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State
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