GRSYS Services offers quality solutions and services to the electronics industry in Brazil. The team has a combined 20 years of marketing know-how with experience in equipment maintenance, process,service, applications and sales.
Replace your old PPU software and DOS computer with a Windows based terminal program for your older Universal Equipment. Drag and Drop capability, program editor, network capable. Works on all Uinversal Instruments machines using UICS Executives. Fe
Electronics Forum | Tue Sep 11 12:55:09 EDT 2007 | fulldraw
We have a 6893 Generator that has the 8222 controller. The drawing package and documents are of the 11 by 17 size but there is not much to them, what do you need to know about it? I know the machine pretty well and can get you whatever you need to k
Industry News | 2019-12-17 14:33:13.0
December 17, 2019 – GPD Global has placed a MAX II precision dispenser at Universal's lab in New York (APL).
Industry News | 2014-02-18 17:01:34.0
The SMTA is pleased to announce the program for the 2014 International Conference on Soldering and Reliability being held May 13-15 in Toronto, Ontario, Canada.
Long term spot supply: Samsung's original new SM/CP Feeder: 8 * 2mm 8 * 4mm 12mm 16mm 24mm 32mm 44mm 56mm Samsung original new SME Feeder: 8mm -56mm Samsung original new TN suction: TN040 TN065 TN140 TN220 TN400 TN400N TN750 TN1100 Samsung or
AI universal parts 44624204/46930412/46930506/46930611/30952105 10894164 SPRING, EXTENSION 10894166 SPRING, EXTENSION 10894167 SPRING, EXTENSION 10894174 SPRING, EXTENSION 10905001 PLUNGER,SPRING 10924000 STUD,NO 5 OVAL HD 10925000 RETAINER,
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
Technical Library | 2017-07-27 16:51:57.0
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components.
Application: Vision Measuring Machine With Probe Applied mainly for 2D measurement and can support some specific 3D measurement as necessary, this instrument is a high precision and high efficiency measuring machine. Designed an
SUPPORT & NEWS Sales and Technical Service Packing and Shipping Latest News Download Catalogue CONTACT US Symor Instrument Equipment Co.,Ltd Email:Sales@climatechambers.com Tel: +86-551-63853683,68663633,663853681 Fax:+86-551-68663630 A
Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA
SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Career Center | , | Engineering,Maintenance,Management,Production,Technical Support
Having 10+years of Experience in manufacturing (SMT),Field Engineer Globally For Universal SMT Equipment .
Career Center | Karachi, Pakistan | Engineering,Maintenance,Research and Development,Sales/Marketing,Technical Support
• Experienced in SMT Production, working on Siplace X Series-S and DEK-Micron Printer, on Siplace Pro and Siplace Explorer. • Having Strongly Skills of calibration of SMT machine, twin head, Multi star head, speed star head, gentry, Nozzles, feeders,
SMTnet Express, October 27, 2016, Subscribers: 26,530, Companies: 15,009, Users: 41,321 Press Fit Technology Roadmap and Control Parameters for a High Performance Process Jose Becerra, Dennis Willie and Murad Kurwa; Flex (Flextronics International
Lead-Free Rework Process For Chip Scale Packages News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Lead-Free Rework Process For Chip Scale Packages Universal Instruments
:00 PM Stant Manufactoring, Inc. 338 2012 LLOYD Instruments LR10KT Plus Digital Tensile Tester/Universal Materials Testing Machine, Force Capacity: 10 kN (2248