Technical Library: universal instruments gsm flex package (Page 1 of 1)

Printed Circuit Board For Industrial Application Drives a wave of Innovation

Technical Library | 2016-08-02 06:04:42.0

The next generation FUNDAS rest on one and only one motto (i.e.) technology up-gradation. For innovations in any corner of the world, a completely unique electronic solution is derived that accounts for fast trending modernization in the lifestyle of humans. With electronic design or manufacturing solution, the printed circuit boards are the groundwork for every electronic project. As the electronic control system and instruments are now applied in every predominant market across the globe, the use of PCB is predicted to have universal application in the global society. This article details you on the type of PCB’s used in the industrial sector, the application of PCB and innovations marked in the industrial sector with current steps taken by PCB manufacturers to provide unique solutions to the industrial sharks. See more: http://www.technotronix.us/pcbblog/printed-circuit-board-for-industrial-application-drives-a-wave-of-innovation/

Technotronix

Assembly And Reliability Issues Associated With Leadless Chip Scale Packages

Technical Library | 2006-10-02 14:26:47.0

This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.

Universal Instruments Corporation

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Technical Library | 2010-01-06 22:27:03.0

Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.

Henkel Electronic Materials

The Effect of Solder Mask And Surface Mount Adhesive Types on a PCB Manufacturing Process.

Technical Library | 1999-07-21 09:04:04.0

A high volume manufacturer of printed circuit boards (PCBs) had attempted for many years to locate an adhesive that was robust enough to meet their manufacturing needs. This proved to be a challenge because they needed the adhesive to accommodate a wide range of different dispensing equipment and board designs. The two key performance criteria required from the adhesive were dispensability and adhesion...

Henkel Electronic Materials

SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing

Technical Library | 2011-08-04 19:29:53.0

This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and

Auburn University

Soft, Wireless Periocular Wearable Electronics For Real-Time Detection Of Eye Vergence In A Virtual Reality Toward Mobile Eye Therapies

Technical Library | 2020-07-22 19:24:33.0

Recent advancements in electronic packaging and image processing techniques have opened the possibility for optics-based portable eye tracking approaches, but technical and safety hurdles limit safe implementation toward wearable applications. Here, we introduce a fully wearable, wireless soft electronic system that offers a portable, highly sensitive tracking of eye movements (vergence) via the combination of skin-conformal sensors and a virtual reality system. Advancement of material processing and printing technologies based on aerosol jet printing enables reliable manufacturing of skin-like sensors, while the flexible hybrid circuit based on elastomer and chip integration allows comfortable integration with a user's head. Analytical and computational study of a data classification algorithm provides a highly accurate tool for real-time detection and classification of ocular motions. In vivo demonstration with 14 human subjects captures the potential of the wearable electronics as a portable therapy system, whose minimized form factor facilitates seamless interplay with traditional wearable hardware.

Georgia Institute of Technology

System Level ESD Part II: Implementation of Effective ESD Robust Designs

Technical Library | 2013-06-27 14:00:27.0

While IC level ESD design and the necessary protection levels are well understood, system ESD protection strategy and design efficiency have only been dealt with in an ad hoc manner. This is most obvious when we realize that a consolidated approach to system level ESD design between system manufacturers and chip suppliers has been rare. This White Paper discusses these issues in the open for the first time, and offers new and relevant insight for the development of efficient system level ESD design.

Industry Council on ESD Target Levels

Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System Level Study

Technical Library | 2020-11-10 15:43:25.0

Flexible hybrid electronics (FHE) interface rigid electronic components with flexible sensors, circuits, and substrates. This paper reports the reliability improvement of a FHE Human Performance Monitor (HPM), designed to monitor electrocardiography (ECG) signals.

Stanford University

Lead-Free Soldering Guide

Technical Library | 2014-05-12 15:32:17.0

The issue of lead-free soldering has piqued a great deal of interest in the electronics assembly industry as of late. What was once an issue that seemed too far away to worry about has become a pressing reality. In order to avoid confusion, last minute panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals users of solders, it is necessary for all suppliers and assemblers to become educated in this matter.

AIM Solder

  1  

universal instruments gsm flex package searches for Companies, Equipment, Machines, Suppliers & Information

Online IPC Training & Certification

ONLINE IPC Training & Certification
IPC Training & Certification - Blackfox

Easily dispense fine pitch components with ±25µm positioning accuracy.
Fourier Transform Infrared Spectroscopy

Best Reflow Oven
Solder Mask & Low Stand-off Component Cleaning

World's Best Reflow Oven Customizable for Unique Applications
Assembly Automation Technology

ARE HUMIDITY INDICATORS PART OF YOUR SUPPLY NETWORK? Register for the webinar!