COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
#1 Stop for all of your Universal Instruments Pick and Place needs Visit our Feeder Frenzy depot to load up on quality pre-owned feeders and feeder repairs~
Replace your old PPU software and DOS computer with a Windows based terminal program for your older Universal Equipment. Drag and Drop capability, program editor, network capable. Works on all Uinversal Instruments machines using UICS Executives. Fe
Electronics Forum | Thu Feb 02 17:35:03 EST 2017 | dilogic
You can register your machine with Universal Instruments for very reasonable fee (I paid ~500$) and get access to their web-based support. Well worth the money. Also, you will be able to order spares, which you will certainly need...
Upgraded to be like an Advantis with windowsOS, 42V feeder interface, and more! Configuration UPS+ 126.96.36.199 - windows software NPI Software - New Product Introduction s/w for quick set-up and minimal scrap Updated VME! Vision ESI-650H c
Industry News | 2019-12-17 14:33:13.0
December 17, 2019 – GPD Global has placed a MAX II precision dispenser at Universal's lab in New York (APL).
Industry News | 2019-10-21 16:37:01.0
MIRTEC is pleased to announce that it has installed one of its Award-Winning MV-6 OMNI 3D AOI Systems at Universal Instruments’ Advanced Process Lab (APL) in Conklin, New York. Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
Technical Library | 2020-03-12 14:14:07.0
IPC's APEX EXPO is always exciting & always fun and, most importantly, always beneficial to those who exhibit and attend. From technical conferences to standards committees to new and exciting things on the show floor - APEX 2020 was indeed a success
Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA
SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Career Center | Poway, California USA | Engineering,Production
Technically qualified in proper operation, troubleshooting, installation /dismantling, programming and preventive maintenance of SMT (Surface Mount Technology) machines. Productivity and quality for the production of PCBA (Printed Circuit Board Ass
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
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