Alpha 1 Technologies is the leading provider to the electronic printed circuit board assembly market. We strive to provide value driven solutions, whether new equipment or used, remanufactured assembly machines since 1999.
PCB depaneling often happen right after SMT processing or after soldering,or after in-circuit test in the assembly line.PCB depaneling machine to be a important equipment in high-volume electronics assembly production. To choose the ASCEN PCB de
#1 Stop for all of your Universal Instruments Pick and Place needs Visit our Feeder Frenzy depot to load up on quality pre-owned feeders and feeder repairs~
Electronics Forum | Thu Apr 18 23:15:26 EDT 2002 | fastek
If Universal for example decides they want to implement a registration fee to pursade customers from buying used then why have they dropped their shorts from $20,000 to register a GSM in 2000 to $2,000 recently? Guess they were tired of losing custom
A GSM1 that has been completely updated by Universal. Windows UPS+ with NPI software, Updated feeder interfaces and banks. Magellan cameras and rebuilt VME. PTF with PTF conveyor included. The perfect solution for hig
Industry News | 2019-12-17 14:33:13.0
December 17, 2019 – GPD Global has placed a MAX II precision dispenser at Universal's lab in New York (APL).
Industry News | 2015-06-08 16:46:35.0
ZESTRON is pleased to announce the SMTA Capital Chapter Tutorial “Enabling Implementation of Advanced Technologies” on June 9th will be held at ZESTRON Americas located at 11285 Assett Loop, Manassas, VA, 20109.
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
Technical Library | 2020-03-12 14:14:07.0
IPC's APEX EXPO is always exciting & always fun and, most importantly, always beneficial to those who exhibit and attend. From technical conferences to standards committees to new and exciting things on the show floor - APEX 2020 was indeed a success
Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA
SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Career Center | , | Engineering,Maintenance,Management,Production,Technical Support
Having 10+years of Experience in manufacturing (SMT),Field Engineer Globally For Universal SMT Equipment .
Career Center | Cavite, Philippines | Maintenance,Production,Technical Support
SKILLS: Mandarin, English skills Quick Learner, willing to be trained Knowledge in Automatic Insertion and Surface Mount Technology Machine (Industrial machines) Can handle and Troubleshoot Electromechanical machines Can read and
SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
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