Technical Library: unloader and machine and of and fuji (Page 1 of 1)

Design and Process Development for the Assembly of 01005 Passive Components

Technical Library | 2018-03-05 11:22:48.0

Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards.

Sanmina-SCI

Quality Improvement and Enhanced Flexibility in Electronic Manufacturing through the Deployment of a modern Selective Soldering Process Technology

Technical Library | 2012-03-15 17:50:28.0

The competition in the EMS sector has considerably intensified over the last few years,. The enormous pressure to reduce production costs, which every service provider today has to face, frequently forces the organization to have a critical look at their

ASYS Group

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