Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and
Electronics Forum | Wed Jul 17 10:22:15 EDT 2013 | rgduval
Sure. Section 7.4 covers unsupported holes, and defines the usual standards. Clinching, fillet on the plated side, lead protrusion, etc. Cheers, ..rob
Electronics Forum | Thu Jan 06 08:03:47 EST 2005 | davef
On solder in vias: It looks like the via are not solder masked well and pick-up solder either: * Solder coating ... OR * During leveling It's possible that the design specifies openings in the solder mask for these via. On solder in the unsupporte
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/pcb-manufacturing
. Non-Stick Surface Activation - The Nordson MARCH plasma process can modify fluoropolymer surfaces and desmear resins to prepare hole walls for electro-less copper or direct metalization
