Industry News: usb and 3.0 (Page 1 of 17)

Joint IPC and UBM Canon Event Generates Sales and Solid Leads for Exhibitors and Valuable Technical Content and Contacts for Attendees

Industry News | 2010-10-30 02:09:14.0

The premiere of Electronics Midwest, a joint production of IPC – Association Connecting Electronics Industries® and UBM Canon, was a confirmed win-win-win success for exhibitors, attendees and organizations alike.

Association Connecting Electronics Industries (IPC)

Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology

Industry News | 2008-07-24 17:38:17.0

Scotts Valley, CA � 15 July, 2008 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq: NDSN) and leader in dispensing, coating and jetting technologies, as a �Partner in Innovation.� Asymtek's Axiom� automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI's 3D vertical interconnect process.

ASYMTEK Products | Nordson Electronics Solutions

Electronics Manufacturers Report Slowing Growth and a Cautiously Optimistic Outlook

Industry News | 2019-12-09 16:03:06.0

Growth is slowing worldwide and the industry’s outlook is less optimistic than in previous quarters, although it is still generally positive, according to the results of IPC’s fourth-quarter 2019 Pulse of the Electronics Industry survey. Based on responses from 82 companies that make up a representative sample of the industry, global third-quarter 2019 sales growth, averaging 3.0 percent, was at its lowest level since the quarterly survey began in mid-2017. The sales growth the respondents predicted for the current quarter is down further, averaging 2.6 percent.

Association Connecting Electronics Industries (IPC)

Clariant turns the spotlight on 3D printed end use functional parts and new material for mobility and E&E trends at formnext 2019

Industry News | 2019-11-15 15:07:04.0

As intelligent industrial manufacturing gains a stronger foothold in production alongside the more established customization/prototyping arenas, Clariant returns to this year’s formnext with new solutions to support the growth. A new halogen-free flame retardant 3D printing material takes center stage alongside eye-catching and unique printed end use parts from a range of applications.

Clariant Cargo & Device Protection

IPC Releases IPC-1755, Conflict Minerals Data Exchange Standard Establishes Requirements for Suppliers and their Customers

Industry News | 2014-04-11 09:15:04.0

IPC – Association Connecting Electronics Industries®, working in partnership with the Automotive Industry Action Group (AIAG), the Conflict-Free Sourcing Initiative (CFSI) and the Japan Electronics and Information Technology Industries Association (JEITA), recently published IPC-1755, Conflict Minerals Data Exchange Standard, to help suppliers and their customers effectively facilitate conflict minerals data exchange along the entire global supply chain.

Association Connecting Electronics Industries (IPC)

ISVI, in cooperation with Symco, demonstrates the future of high-speed machine vision at ITE Yokohama CoaXPress has paved the way for successful high-speed and high-resolution applications

Industry News | 2013-11-15 18:02:04.0

ISVI Corp. will show its latest CoaXPress cameras together with its Distribution Partner, SYMCO Corporation of Tokyo, Japan, at the ITE Yokohama 2013 Vision Show from 4-6 December at the Symco Booth Hall D #54. By showing their cutting-edge technologies, ISVI and Symco will demonstrate how easy it is to integrate the CoaXPress interface into all high-speed and high-resolution applications including AOI, SPI and semiconductor inspection.

ISVI - Industrial Sensor Vision International Corporation

IPC Releases IMS/PCB Book-to-Bill Ratio and IMS/PCB Business Report for February 2003

Industry News | 2003-04-01 08:32:03.0

Recently selected IMS as a better designation for the PCB industry, to better reflect the services provided to customers.

Association Connecting Electronics Industries (IPC)

Saelig Introduces USB 3.0 SuperSpeed Isolator For Electrical Isolation of USB Ports

Industry News | 2018-11-29 16:33:25.0

USB 3.0 SuperSpeed Isolator eliminates ground loops and ground potential differences and is ideal for measurement, industrial, automotive and audio technology applications.

Saelig Co. Inc.

Macrotron Systems, Inc. announces MacroVault™ USB 3.0 OEM/ODM flash drive solutions.

Industry News | 2012-11-26 14:09:09.0

Macrotron Systems announces availability of its MacroVault OEM/ODM USB 3.0 flash drive solutions.

Macrotron Systems

ADLINK Announces its First COM Express® 3.0 Type 7 Computer-on-Module

Industry News | 2016-08-02 13:02:42.0

ADLINK Technology announced its first computer-on-module (COM) based on the latest PCI Industrial Computer Manufacturers Group (PICMG®) COM Express® 3.0 specification with new Type 7 pinout, for which ADLINK lead development efforts to bring a server-grade platform and 10 Gigabit Ethernet (GbE) capabilities to a COM form factor. ADLINK’s Express-BD7 targets customers building space-constrained systems in industrial automation and data communication, such as virtualization, edge computing or other numerical applications, that require high density CPU cores balanced by reasonable power consumption.

ADLINK Technology, Inc.

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