Industry News: use of pb-free with uthective solder (Page 1 of 4)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

Update of IPC J-STD-609 Provides Greater Delineation of Lead-free Solders for Marking and Labeling

Industry News | 2010-04-10 02:05:54.0

IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.

Association Connecting Electronics Industries (IPC)

MPM Completes Next Generation Momentum II Printer Line with Introduction of BTB and 100 Models

Industry News | 2020-04-14 19:07:23.0

ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.

ITW EAE

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

Industry News | 2015-02-04 18:05:58.0

he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.

Surface Mount Technology Association (SMTA)

Donald Tyler, Corfin, to Present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip” at the SMTA Capital Chapter Meeting March 17th

Industry News | 2015-03-11 18:05:46.0

The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.

Surface Mount Technology Association (SMTA)

ASYMTEK Products Elevates the Excellence of Electronics to New Heights with Advanced Dispensing, Coating, and Software Product Solutions at IPC APEX EXPO - Booth 1611

Industry News | 2020-01-23 17:30:46.0

ASYMTEK brings its latest fluid dispensing and conformal coating solutions to IPC APEX EXPO, San Diego, CA, in booth 1611. New at IPC APEX is the ASYMTEK Vortik™ family of progressive cavity pumps (PCP), with the smallest depositions possible on the market today. The VPs, VPm, and VPg pumps rely on positive displacement to provide continuous needle dispensing of one- and two-component fluids with high-volumetric accuracy, increased reliability, and reduced cycle time. At 0.2 microliters per second, the Vortik VPs offers the lowest flowrate and smallest depositions possible across all PCP pumps available in the market today - delivering precise control of narrow lines and small shots for two-component mixed fluids.

ASYMTEK Products | Nordson Electronics Solutions

Recover up to 80% of pure solder with EVS – Learn more at SMTA Guadalajara

Industry News | 2018-10-15 18:59:13.0

EVS International, the leader in solder recovery, will exhibit with InterLatin on Stand 77 at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Nov. 14 - 15, 2018 at the Expo Guadalajara. EVS will show the EVS 500LF Solder Recovery System that can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross.

EVS International

Indium Corporation Announces High-Melting Pb-free Solder Alternatives Agreement with Ormet Circuits

Industry News | 2010-04-23 18:53:17.0

Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.

Indium Corporation

Nihon Superior to Collaborate with University of Queensland

Industry News | 2008-03-08 04:04:22.0

OSAKA, JAPAN � March 7, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is collaborating with the University of Queensland (Australia) in the investigation of the growth and properties of the intermetallic compounds that form between solder alloys and the soldered substrate.

Nihon Superior Co., Ltd.

Take control of your materials with Insituware at SMTconnect

Industry News | 2022-04-28 14:40:09.0

Insituware LLC is pleased to announce plans to exhibit in Hall 5, Stand 228 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg. The Insituware team will demonstrate the Vision MARK-1 and provide additional insight for its two newest products, the SM-100 Solder Paste Smart Mixer and the CC-100 Conformal Coating Thickness Tester.

Insituware LLC

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