Industry Directory | Manufacturer
Welcome to DPL Industri Denmark The specialist of Ultraviolet Curing and LED Curing Technology In the past 20 years, DPL have not only to maintain the production of high quality Easycure TM Cold UV
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
The Worlds Largest Distributor of New, Refurbished, and Second Hand Electronic Test and Measurement (T&M) Equipment.
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Solder Paste Stencils
For the DIYer, hobbyist or technical researcher there are times where all you need is a simple means to apply solder paste for SMT devices for a few simple boards. In those cases a plastic SMT stencil may be the right solution. Eliminate the tedious
Electronics Forum | Thu Jan 11 20:42:24 EST 2007 | davef
1 Tape & reel, automatic * RVSI/Systemation ST-60 * Shinkawa SDP-FA-TAPE 1 * V-TEK TM-5100 2 Tape & reel, manual * RVSI/Systemation MT-30 * V-TEK TM-50XL
Electronics Forum | Tue May 14 19:25:18 EDT 2013 | jeffr
V-Tek TM4000 PLC program. Does anyone have a soft or hard copy of the PLC code? The machine uses a GE-Fanuc LM90-30 PLC. Thanks....
Used SMT Equipment | Pick and Place/Feeders
Mydata TM8FC Feeder 8mm Fine C Item Location: Willoughby, OH USA
Used SMT Equipment | Pick and Place/Feeders
Mydata TM12C Magazine 12mm Tape A Item Location: Willoughby, OH USA
Industry News | 2021-06-26 09:04:13.0
Whizz Systems, Inc. today announced the addition of a Powersonic™ Benchtop Ultrasonic Cleaner from Crest Ultrasonics.
Industry News | 2003-04-02 09:03:49.0
Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation
Parts & Supplies | Assembly Accessories
Original new JUKI E620370600C FEEDER UPPER COVER 3232 Specifications: Brand Name JUKI FEEDER UPPER COVER Part number E620370600C Model FF32FS Ensure Test in machine before shipping Guarantee Original 100% Supply all juki spare parts at l
Parts & Supplies | Depanelizers / Routers
YAMAHA Smt Chip Mounter Magnetic Support Pin KG2-M921B-10X Made in China KV7-M921D-10X Push Pin K98-M9213-10X push up KV7-M9213-10X push up KG2-M921B-10X push up 9965 000 10371 push-up pin assy PCB KM8-M6601-000 HARNESS 1 1 40 KH5-M662T-0
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
Technical Library | 1999-05-06 14:39:20.0
ntelís traditional microprocessor test methodology, based on manually generated functional tests that are applied at speed using functional testers, is facing serious challenges due to the rising cost of manual test generation and the increasing cost of high-speed testers. If current trends continue, the cost of testing a device could exceed the cost of manufacturing it. We therefore need to rely more on automatic test pattern generation (ATPG) and low-cost structural testers.
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