Vapour Phase Soldering system, Selective Wave soldering system, Solder recovery system, used/refurbished SMT/Semiconductor related equipment
Selettra Technologies is a new dynamic distributor for France and North Africa. Our main products are Inertec for selective soldering, FocalSpot Xray inspection, SAKI AOI, ASSCON vapour phase soldering, KOLB Cleaning machines, etc.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Electronics Forum | Tue Oct 03 22:10:42 EDT 2006 | jonatf
Hi guys, Our vapour phase oven is taking too long to heat up about 15 mins/cycle. Normally its 5 to 6 mins. 2 reasons why. 1.using 10 amp power board 2.heating element not working properly. before i set up a 15 amp outlet i want to know first if my
Electronics Forum | Wed Oct 04 03:44:23 EDT 2006 | slaine
you should be able to work out the resistance of the heater element from the power rating (watts), and the Voltage its working at. then measure the resistance of the element and see if your anywhere near.
Used SMT Equipment | Soldering - Reflow
• Nitrogen • Edge Belt Conveyor • Mesh Belt Conveyor • Auto Chain Oiler • 350 C Max Temp • Flux Management System • 480, Volt, (3) Phase • (10) Upper and (10) Lower Convection Heating Zones • (2) Cooling Zones • Condition: Complete & Operat
Used SMT Equipment | Soldering - Reflow
Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature. Complete Computer Control System including: Flat Panel
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Parts & Supplies | Pick and Place/Feeders
we are big siemens/ASM spare part selling in sotck. if you are any interesting,pls fre contact us 00141099 Tape feeder module 3x8mm S-feeder exclusively for 0201/0402 00141098 Feeder 3x8mm S 00141088 SL feeder 00117010 Dip module f. fluxes an
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Technical Library | 2014-03-27 14:50:01.0
Because of the phase out of CFC's and HCFC's, standard solder pastes and fluxes evolved from RA and RMA fluxes, to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices.
Nano-copper sintering in formic acid vapor.
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Career Center | Barcelona, Spain | Management,Sales/Marketing
Are you interested to work for a successful global company operating in 35 countries? Would you like to learn more about innovative cleaning technologies, which are used in electronic assembly? We belong to TOP 3 companies in our industry worldwide
Career Center | Houston, Texas USA | Engineering,Management,Production
SMT Manufacturing Engineer – 2nd Shift Hunting Innova is a Houston based company serving industrial, energy, medical, defense and aerospace segments of the Electronic Manufacturing Services (EMS) Industry since 1989. Hunting Innova is located in N
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
De-fluxing Eases "Sticky Situations" De-fluxing Eases "Sticky Situations" Using a contract assembler offers several benefits. However, when outsourcing a no-clean process, the challenge for contract assemblers lies with the multiple applications
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
. To address this issue the flux has to be more active and have the ability to not break down at vapor phase reflow temperatures. I would suggest getting in touch with the solder paste manufacturer and evaluating a more robust flux material in the solder paste rheology composition
| http://etasmt.com/cc?ID=te_news_bulletin,23566&url=_print
gas phase Formic Acid (HCOOH) to replace standard fluxing agents Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps No post-reflow flux clean facilitates inline application of epoxy and inline epoxy
