Industry Directory: via (141)

Visual Components Oy

Industry Directory |

Use Visual Components to test, collaborate, communicate and confirm in visually rich 3D graphics via the Web.

New SMT Equipment: via (29156)

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Electronics Forum: via (1639)

via

Electronics Forum | Thu Nov 01 17:30:55 EST 2001 | davef

Search the fine SMTnet Archives for ... via and pad

via

Electronics Forum | Thu Nov 01 15:14:47 EST 2001 | jacob

Hello, I am trying to convince our design engineer to use micro-vias when he has to locate them in the middle of a pad. I heard of the use of micro-vias on this site and was wondering if someone could lead me in the direction of somewhere

Used SMT Equipment: via (304)

Viscom S3088-III

Viscom S3088-III

Used SMT Equipment | AOI / Automated Optical Inspection

This item is part of our online equipment auction happening right now. The bidding for this auction begins closing on Thursday, 12/9, at 1pm EST. Click the following link to view more photos and details: https://bajabid.hibid.com/lot/107722753

Baja Bid

Vitronics 6622CC Wave Solder

Vitronics 6622CC Wave Solder

Used SMT Equipment | Soldering - Wave

Model:  6622CC Vintage:  2006 Details: • Windows 7 operating system • Lead Free capable (was running lead, and will need tin wash). • 18” max width adjust • Measured Values Read-out of Frequency controlled motors on PC screen • 400V / 3 Phase

Lewis & Clark

Industry News: via (1275)

GPD Global to Focus on PCD Dispensing at ATX West 2011

Industry News | 2011-01-12 17:48:44.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

GPD Global

GPD Global to Promote PCD Dispensing at the SMTA Dallas Expo & Tech Forum

Industry News | 2011-02-04 01:47:14.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing at the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX.

GPD Global

Parts & Supplies: via (23)

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

Juki SMT Machine JUKI Visker Feeder 16MM / 24MM Professional Motorized Feeder

Juki SMT Machine JUKI Visker Feeder 16MM / 24MM Professional Motorized Feeder

Parts & Supplies | Assembly Accessories

Detailed Product Description Brand: Visker Model: 8mm Part Name: Feeder Driver: Motorized Lead Time: Within 3days Machine Model: JUKI All Model SMT Machine JUKI Visker Feeder 16MM / 24MM Professional Motorized Feeder​ Description: Model:

KingFei SMT Tech

Technical Library: via (49)

Flip Chip Attach Techniques

Technical Library | 2019-05-21 17:38:55.0

Last month we presented Flip Chip Rework.As promised, this month we follow up with attachment techniques. Flip chip assembly is a key technology for advanced packaging of microelectronic circuits. It allows attachment of a bare chip to a packaging substrate in a face-down configuration, with electrical connections between the chip and substrate via conducting “bumps.” Flip chip technology was first invented by IBM for mainframe computer application in the early 1960s. Semiconductor devices are mounted face down and electrically and mechanically connected to a substrate (Figure 1). IBM called this manufacturing process a C4 process (controlled collapse chip connection).

ACI Technologies, Inc.

A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested

Technical Library | 2020-12-07 15:26:06.0

Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.

ACI Technologies, Inc.

Videos: via (171)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Training Courses: via (16)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

IPC-6012 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-6012 Trainer (CIT)

The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: via (9)

Quality Adhesive Technologies from LOCTITE - Free Workshop

Events Calendar | Tue Jun 04 00:00:00 EDT 2019 - Tue Jun 04 00:00:00 EDT 2019 | Philadelphia, Pennsylvania USA

Quality Adhesive Technologies from LOCTITE - Free Workshop

ACI Technologies, Inc.

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Jobs: via (45)

SMT Operator

Career Center | Chicago, Illinois USA | Production

North side manufacturing company seeks experienced SMT operator for pick and place, printer, and reflow oven machines. Experience operating wave solder machine also required. Please send resumes to 773.275.0283(fax) or via email to jhagerman@jeron.co

Jeron Electronic Systems, Inc.

EVP Global EMS Operations

Career Center | San Jose, California USA | Management

DCSI is one of the most trusted and respected global executive search and solutions companies inthe electronics manufacturing industries.  We have more than 35 active openings that range from Managers, Directors, Sr. Directors, Vice Presidents, to EV

DCSI International Executive Recruiting

Career Center - Resumes: via (29)

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Customer Service Engineer

Career Center | Lalkua, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support

Machine maintenance Service and support knowledge with customer satisfactory. Deal with customers at all level via phone,remote and mail.Sound knowledge of PCB fabrication machine.

Express Newsletter: via (143)

SMTnet Express - June 27, 2019

SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key

SMTnet Express - July 16, 2020

SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular

Partner Websites: via (4656)

VIA High Volume Series | Nordson MARCH

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/via-high-volume-series

VIA High Volume Series | Nordson MARCH MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications

ASYMTEK Products | Nordson Electronics Solutions

SolderTips: Avoiding the Creation of Splices Via Wire Twisting | EPTAC

| https://www.eptac.com/soldertips/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/

SolderTips: Avoiding the Creation of Splices Via Wire Twisting | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes


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