Industry Directory: via (140)

Visual Components Oy

Industry Directory |

Use Visual Components to test, collaborate, communicate and confirm in visually rich 3D graphics via the Web.

New SMT Equipment: via (26279)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: via (1622)

via

Electronics Forum | Thu Nov 01 17:30:55 EST 2001 | davef

Search the fine SMTnet Archives for ... via and pad

via

Electronics Forum | Thu Nov 01 15:14:47 EST 2001 | jacob

Hello, I am trying to convince our design engineer to use micro-vias when he has to locate them in the middle of a pad. I heard of the use of micro-vias on this site and was wondering if someone could lead me in the direction of somewhere

Used SMT Equipment: via (300)

Vitronics 6622CC Wave Solder

Vitronics 6622CC Wave Solder

Used SMT Equipment | Soldering - Wave

Model:  6622CC Vintage:  2006 Details: • Windows 7 operating system • Lead Free capable (was running lead, and will need tin wash). • 18” max width adjust • Measured Values Read-out of Frequency controlled motors on PC screen • 400V / 3 Phase

Lewis & Clark

DEK dek_horizon02i_TDS

DEK dek_horizon02i_TDS

Used SMT Equipment | Screen Printers

HORIZON 02i Approx. Weight 820kg boxed  677kg unboxed Approx. Dimensions  2060mm x 1500mm x 1570mm (81.1” x 59” x 61.8”) Accuracy and Repeatability 1.6 Cpk @ +/- 25 m Cycle Core Time 12 seconds Max. Board Size (Print Area) 508mm (X) x 508mm (Y)

Qinyi Electronics Co.,Ltd

Industry News: via (1242)

Europlacer Connected at APEX 2020

Industry News | 2020-01-07 11:32:07.0

Europlacer Americas will focus on it CFX Factory 4.0 connectivity at APEX 2020. Live demonstrations on the Europlacer booth #1910 will feature the company’s mobile app dashboard displaying production data streamed live. At the heart of the booth will be the award-winning atom3 ultra-flexible multi-functional assembly system – itself connected via CFX to the dashboard.

EUROPLACER

GPD Global to Focus on PCD Dispensing at ATX West 2011

Industry News | 2011-01-12 17:48:44.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

GPD Global

Parts & Supplies: via (23)

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

Juki SMT Machine JUKI Visker Feeder 16MM / 24MM Professional Motorized Feeder

Juki SMT Machine JUKI Visker Feeder 16MM / 24MM Professional Motorized Feeder

Parts & Supplies | Assembly Accessories

Detailed Product Description Brand: Visker Model: 8mm Part Name: Feeder Driver: Motorized Lead Time: Within 3days Machine Model: JUKI All Model SMT Machine JUKI Visker Feeder 16MM / 24MM Professional Motorized Feeder​ Description: Model:

KingFei SMT Tech

Technical Library: via (403)

An Air-Assisted "Airless" Conformal Coating Process

Technical Library | 1999-08-27 09:18:58.0

A need to move beyond aerosol sprays and dipping leads to a development that answers tough requirements for controlled coverage, low waste, and environmental restrictions.

Nordson ASYMTEK

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: via (139)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

Videos

High speed glue dispenser from GPD Global. You can get speed upto 45,000 dots per hour.

GPD Global

Training Courses: via (8)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

IPC-6012 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-6012 Trainer (CIT)

The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: via (13)

SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices

Events Calendar | Tue Feb 10 13:00:00 EST 2015 - Tue Feb 10 14:30:00 EST 2015 | ,

SMTA Webtorial: Electromigration – The Hurdle For Miniaturization and High Power Devices

Surface Mount Technology Association (SMTA)

Quality Adhesive Technologies from LOCTITE - Free Workshop

Events Calendar | Tue Jun 04 00:00:00 EDT 2019 - Tue Jun 04 00:00:00 EDT 2019 | Philadelphia, Pennsylvania USA

Quality Adhesive Technologies from LOCTITE - Free Workshop

ACI Technologies, Inc.

Career Center - Resumes: via (29)

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Customer Service Engineer

Career Center | Lalkua, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support

Machine maintenance Service and support knowledge with customer satisfactory. Deal with customers at all level via phone,remote and mail.Sound knowledge of PCB fabrication machine.

Express Newsletter: via (133)

SMTnet Express - June 27, 2019

SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key

SMTnet Express - July 16, 2020

SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular

Partner Websites: via (3696)

VIA High Volume Series - Nordson MARCH

Nordson ASYMTEK | https://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/via-high-volume-series

VIA High Volume Series Nordson MARCH MARCH Products Corporate Global Directory Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series XTRAK System RIE System PD Plasma Deposition Series PROGENY System PCB Systems VIA High

Nordson ASYMTEK

SolderTips: Avoiding the Creation of Splices Via Wire Twisting - EPTAC

| https://www.eptac.com/soldertips/soldertips-avoiding-the-creation-of-splices-via-wire-twisting/

SolderTips: Avoiding the Creation of Splices Via Wire Twisting EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes


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