New Equipment | Education/Training
This program is for experienced solderers seeking an in depth knowledge of the J-STD-001 Document. The course reviews this document and helps students learn how to interpret the criteria. Open and closed book exams are required after each module. Han
New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Tue Jul 06 19:38:01 EDT 1999 | John
Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. Q #2) When speaking of annular rings, I have always thought of them as minimums. Su
Industry News | 2012-04-06 15:32:39.0
GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Parts & Supplies | SMT Equipment
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Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 best quality & lower price more than we can offer 40045136 LASER SENSOR CONTROLLER ASM E43197170A0 LASER SENSOR BASE ASM E90647170A0 LASER SENSOR CONTROLLER ASM. E9608717000 L
Technical Library | 2019-07-17 17:56:34.0
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface. In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented.
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Career Center | Marietta, Georgia USA | Engineering,Management,Production
Experienced electronic supervisors and technicians are needed for immediate openings in the Atlanta area. Qualified candidates will be skilled in Surface Mount Technology (SMT) and Thru-Hole Technology (THT) with 2 years experience in an electronic
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future
| https://www.eptac.com/webinars/plated-through-hole-fill-understanding-the-process-and-assembly-requirements/
Plated Through Hole Fill: Understanding the Process and Assembly Requirements - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/industries/automotive-and-transportation?con=t
Guadalajara Expo and Tech Forum Nordson SELECT Bob Klenke to discuss solutions for selective soldering of challenging through-hole components Nordson SELECT to Exhibit Award Winning Selective Soldering
