Industry Directory: via holes fill (41)

Uniwell (HK) Electronics Co.,ltd (uwellpcb.com)

Industry Directory | Manufacturer

UWELLPCB.com is the PCB supplier. We offer PCB from single side board, double side PCB to 32layer board,including the Rigid PCB, Flex PCB, Rigid-flex PCB,Quick-turn prototype and PCB assembly

Sierra Circuits Inc.

Industry Directory | Manufacturer

A printed circuit board manufacturer producing high quality prototype printed circuit boards.

New SMT Equipment: via holes fill (550)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Electronics Forum: via holes fill (776)

Filling via holes during the reflow process

Electronics Forum | Mon Mar 04 11:08:56 EST 2002 | Matt Kehoe

We have a customer that desires to have their via holes plugged with solder after assembly. Is it possible to add the via holes to the stencil and print paste into them and expect them to plug? If so, how much paste? One to one on the stencil opening

Filling via holes during the reflow process

Electronics Forum | Tue Mar 05 22:34:27 EST 2002 | YoYo

You better be careful how you plug vias at screenprint - we currently have a customer that wants vias plugged, so we had a 2% aperature reduction so we would not have to much paste, I believe it should have been reduced more because some of the solde

Used SMT Equipment: via holes fill (8)

Nordson DAGE X-RAY XD7500

Nordson DAGE X-RAY XD7500

Used SMT Equipment | X-Ray Inspection

• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st

Qinyi Electronics Co.,Ltd

Speedline Aquastorm 200 (Torrid Zone) In-line Aqueous Cleaning System (2004)

Speedline Aquastorm 200 (Torrid Zone) In-line Aqueous Cleaning System (2004)

Used SMT Equipment | Board Cleaners

Speedline Electrovert Aqueous Cleaning System In-line Cleaner Model: Aquastorm 200 (Torrid Zone) Year: 2004 S/N 480409 Prewash Module: 14" (36cm ) section Vee Jets staggered nozzles, 2 upper and 2 lower spray manifolds Valve switching to div

Tekmart International Inc.

Industry News: via holes fill (329)

GPD Global to Focus on PCD Dispensing at ATX West 2011

Industry News | 2011-01-12 17:48:44.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

GPD Global

See GPD Global's PCD Technology at IMAPS Device Packaging 2011

Industry News | 2011-02-17 15:04:54.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.

GPD Global

Parts & Supplies: via holes fill (1)

Bicheng CSP printed circuits

Bicheng CSP printed circuits

Parts & Supplies | Circuit Board Assembly Products

1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm,6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish

Bicheng Enterprise Company

Technical Library: via holes fill (31)

Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing

Technical Library | 2019-06-21 10:39:15.0

Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.

ACI Technologies, Inc.

Via Filling Applications in Practice

Technical Library | 2020-07-15 18:49:03.0

Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias

Würth Elektronik GmbH & Co. KG

Videos: via holes fill (54)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

MAX II - Heated.  Underfill with Jetting Pump NCM5000

MAX II - Heated. Underfill with Jetting Pump NCM5000

Videos

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Training Courses: via holes fill (8)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

IPC-6012 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-6012 Trainer (CIT)

The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: via holes fill (2)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

X-Ray of PCBs Webtorial

Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA

X-Ray of PCBs Webtorial

BEST Inc.

Career Center - Jobs: via holes fill (6)

SMT Machine Operator

Career Center | Valley View, Ohio USA | Production

Machine operator to operate an automated through hole and Surface Mount Technology (SMT) industrial soldering machines. Operator should have 1 year hands on experience operating the Universal (Sanyo) GSM Platform Machine. Must be proficient en

Manpower Professional

Regional Sales Manager

Career Center | , Florida USA | Sales/Marketing

Multinational Florida-based company seeks dynamic sales professional to fill the position of Regional Sales Manager. The qualified individual will have a strong background in electronic manufacturing services and sound knowledge of the electronic co

Personnel Concerns, Inc.

Career Center - Resumes: via holes fill (12)

JAMES R

Career Center | ELLENWOOD, Georgia USA | Production,Quality Control,Research and Development,Technical Support

SMT MACHINE OPERATION, FORKLIFT CERTIFY,  SUPERVISION OF MANUFACTURING AND PRODUCTION, QUALITY CONTROL TECH., AUDIO ENGINEER SKILLS,,SET-UP OF MUSICIAL THEMES AND PLAYS.

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Express Newsletter: via holes fill (437)

SMTnet Express - July 16, 2020

SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular

SMTnet Express - June 27, 2019

SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key

Partner Websites: via holes fill (596)

QFN Thermal Via Pitch - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914.html

.  According to the IPC-7093A you can also solder mask define the thermal pad to dam in the paste mask to prevent it from flowing into via holes

PCB Libraries, Inc.

Dispensing Heated Underfill, Encapsulation, Glob top, COB, Dam & Fill

GPD Global | https://www.gpd-global.com/co_website/heatConfigurations-max2.php

Dispensing Heated Underfill, Encapsulation, Glob top, COB, Dam & Fill   Home   Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader

GPD Global


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Easily dispense fine pitch components with ±25µm positioning accuracy.
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