Vitronics Soltec XPM3-1030 Reflow Oven Max. Width of PCB 450mm Heating zones: 10 Heating method: Hot Air Conveyor speed 0-2000mm/min Product description: Vitronics Soltec XPM3-1030 Reflow Oven Edge/Mesh belt, 10 zone, Dimension(L*W*H) 5200&tim
The Vitronics Soltec XPM3 product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transf
Electronics Forum | Wed Apr 11 12:17:05 EDT 2018 | randywoods
I need to perform maintenance. On reflow oven. I do not remeber procedure for opening. Hood for reflow oven. Vitronis Soltec XPM2.
Electronics Forum | Thu Apr 12 09:06:25 EDT 2018 | deanm
If its like our XPM3i there is a keyswitch on the right hand side of the console above the keyboard.
Industry News | 2021-06-08 09:22:40.0
Baja Bid is hosting an online auction event featuring items from: Mydata, DEK, Vitronics, Universal and much more. The bidding period began yesterday, June 7, at 8:00am EST. The bidding period will begin closing tomorrow, June 9, at 1pm EST.
Technical Library | 2011-08-04 19:29:53.0
This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Career Center | Obour, Egypt | Engineering,Maintenance,Production
Ten years of experience in electronics assembly work for Toshiba Egypt and Iskraemeco Egypt • Researched, analyzed and selected production equipment. • Work within team to startup Iskraemeco’s new factory in Egypt. • L