The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
36” Russell Finex Screeners S/S-1 Deck (8) Available Used Russell Finex model #25070.1.5 Sifters available for immediate sale. Stainless steel contact surfaces. One deck for two separations. 36 in. O.D. screening surface. 1.5 HP Totally enclos
Electronics Forum | Tue Sep 15 13:02:55 EDT 2009 | horvath83
What do you think about optimal setup for 8-hour working shift and 16-hour standby time. What is the most energy efficient setup for standby time? Complete cooldown or maintaining temperature in solder pot?
Electronics Forum | Wed Sep 16 09:04:12 EDT 2009 | stepheniii
All the heat that comes off the machine comes from powering the machine. The more heat that comes off it, the more energy that went into the machine. When the machine is cold there is no heat energy leaving the machine. Therefore complete cooldown
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2015-05-18 10:27:49.0
Heller Industries has been awarded a 2015 SMT China Vision Award in the category of Reflow Soldering for its 1936 Mark 5 Reflow Oven. The award was presented during April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China 2015.
Feeder control panel :N610032084AA/ KXF0DWTHA00 CM202 boards 1, CM202 head board KXFE003YA00:MC02CX-8 2, CM202 LED lighting control card KXFP66AAA00 CM101 boards 1, CM101 pallet card: N610136306AA(18 stack) CM402 boards 1. CM402 tro
Panasonic SMT CM402 CM602 Feida feeding motor N510048142AA MTNM000016AA CM402 CM602 Magnetic Thimble N610133066AA CM602 Magnetic Thimble N610133066AA CM602 Magnetic Thimble N610133066AA CM402 CM602 NPM Delta Side Cover KXFA1PQ9A00, KXFA1PR0A00, K
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
The ZEVAm+ selective soldering machine brings patented soldering technology that excels at meeting the challenges of miniaturization. Tilting allows the ZEVAm+ to solder at any angle to guarantee proper soldering results for the ever decreasing pitch
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
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