The Vitronics Soltec XPM3 product platform is the latest evolution in a long history of reflow systems that have proven their capability worldwide and established a reputation for superior reliability. Robust design combined with a unique heat transf
Vitronics Soltec XPM3-1030 Reflow Oven Max. Width of PCB 450mm Heating zones: 10 Heating method: Hot Air Conveyor speed 0-2000mm/min Product description: Vitronics Soltec XPM3-1030 Reflow Oven Edge/Mesh belt, 10 zone, Dimension(L*W*H) 5200&tim
Electronics Forum | Tue Jun 14 11:57:21 EDT 2005 | ??
Are any of you guys out there using the vitronics xpm oven's having problems with the muffin fans dying on the top of the oven. Seems to me that they are using an inferior muffin fan that is not rated for the environment they are in. The fans have sl
Electronics Forum | Tue Jun 14 15:47:41 EDT 2005 | OverTheHill
Yes, the original fans were junk. I replaced them all with a ball bearing type. No problems for 3 years now. Manufacturer----- Rodale Phone No. 1-714-283-3140 Part No.---------- RC-A12M15HTB I think they were about $25.00 US bucks each back th
Industry News | 2015-03-09 12:04:13.0
Baja Bid is conducting an online auction. The bidding period opened on March 2, 2015 and closes on March 18, 2015.
Technical Library | 2011-08-04 19:29:53.0
This work covers two major projects aimed at increasing quality and efficiency on a high mix, low volume surface mount electronics production line. Specifically the installation of a ten zone reflow oven and an enhanced changeover method for SMT pick and
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Career Center | Obour, Egypt | Engineering,Maintenance,Production
Ten years of experience in electronics assembly work for Toshiba Egypt and Iskraemeco Egypt • Researched, analyzed and selected production equipment. • Work within team to startup Iskraemeco’s new factory in Egypt. • L