New SMT Equipment: void+in (1)

Thick-Copper PCB

Thick-Copper PCB

New Equipment | Assembly Services

Thick-Copper PCB Material: Fr-4 Layer Count: 4 layers PCB Thickness: 1.4mm Min. Trace / Space Outer: 0.065mm Min. Drilled Hole: 0.2mm Via Process: Tenting Vias Surface Finish: ENIG Product Features Features: 1) Years of experience in half-

NextPCB-Reliable Multilayer Boards Manufacturer

Electronics Forum: void+in (1)

Voids in SMD reflowed solder joints

Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan

Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids

Industry News: void+in (2)

Indium Corporation Wins Global Technology Award

Industry News | 2006-09-29 17:32:14.0

Indium Corporation was recognized with the Global Technology Award for its Indium5.1AT Pb-Free Solder Paste

Indium Corporation

Indium Corporation Wins 2007 Innovation Award

Industry News | 2007-05-02 12:18:23.0

Indium Corporation�s Indium5.1AT Pb-Free Solder Paste was awarded the Innovation Award at Nepcon China in Shanghai, China.

Indium Corporation

Partner Websites: void+in (353)

Key Advances in Void Reduction-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23577&url=_print

Key Advances in Void Reduction-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Key Advances in Void Reduction Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores new advances in the reflow soldering process

UNDERFILL VOIDS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2271-underfill-voids

. Result The large dark feature is a trapped bubble, or void, in the underfill. Since gating at this depth also includes the bonds of the solder bumps to the chip face, it is possible to see that all bumps have the same appearance

ASYMTEK Products | Nordson Electronics Solutions


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