Industry Directory: void on bga after reflow oven (4)

Count On Tools, Inc.

Count On Tools, Inc.

Industry Directory | Manufacturer

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

kurtz ersa Corporation

Industry Directory | Manufacturer

Manufacturer of Selective Soldering Systems, Ersascope BGA Inspection Systems, BGA Rework Systems, Soldering Irons, Wave Solder and Reflow Equipment.

New SMT Equipment: void on bga after reflow oven (1040)

Small SMT Reflow Oven Nitrogen PCB Solder Reflow Oven

Small SMT Reflow Oven Nitrogen PCB Solder Reflow Oven

New Equipment | Reflow

Small SMT Reflow Oven Nitrogen PCB Solder Reflow Oven​ ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology |  25 years SMT technology experience | professi

Dongguan Intercontinental Technology Co., Ltd.

High Performance Reflow Oven SMT PCB Reflow Soldering Oven Machine Price

High Performance Reflow Oven SMT PCB Reflow Soldering Oven Machine Price

New Equipment | Reflow

High Performance Reflow Oven SMT PCB Reflow Soldering Oven Machine Price​ ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology |  25 years SMT technology ex

Dongguan Intercontinental Technology Co., Ltd.

Electronics Forum: void on bga after reflow oven (244)

Blow hole on pad after reflow oven

Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi

Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint

Blow hole on pad after reflow oven

Electronics Forum | Thu Jan 20 11:02:46 EST 2011 | dyoungquist

Armando Link does not work. Goes to a "page not found" error in flickr.

Used SMT Equipment: void on bga after reflow oven (1)

Torch A8N

Torch A8N

Used SMT Equipment | Soldering - Reflow

A8N Main electric part uses international brand components. Temperature control design achieves international advanced level with stable and even temperature. It is suitable for soldering CSP, BGA component. Energy-saving inner oven design and heat

Beijing Torch Co.,Ltd

Industry News: void on bga after reflow oven (57)

SMTA Capital Chapter will host a FREE webinar with Fred Dimock, BTU International, on January 20th

Industry News | 2021-01-06 17:17:19.0

The SMTA Capital Chapter is excited to host the first chapter webinar of 2021 on January20that11:00 AM EST.Fred Dimock, BTU International, will be presenting "Operation of a Vacuum Reflow Oven with Updated Void Reduction Data."

Surface Mount Technology Association (SMTA)

Fred Dimock, BTU International, to Present at SMTA Capital Chapter Meeting on January 10th

Industry News | 2018-12-11 19:24:48.0

The SMTA Capital Chapter is excited to host a Chapter Meeting on January 10th from 5:00 PM to 7:30 PM at ZESTRON, Manassas, VA. Fred Dimock, BTU International, will be presenting “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data.”

Surface Mount Technology Association (SMTA)

Technical Library: void on bga after reflow oven (1)

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Technical Library | 2024-02-02 07:48:31.0

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Videos: void on bga after reflow oven (183)

Flux spray coating on PCB with DispenseJet DJ-2200

Flux spray coating on PCB with DispenseJet DJ-2200

Videos

Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.

ASYMTEK Products | Nordson Electronics Solutions

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

Events Calendar: void on bga after reflow oven (1)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Career Center - Resumes: void on bga after reflow oven (8)

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Express Newsletter: void on bga after reflow oven (993)

SMTnet Express - August 17, 2017

SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell

Reliability of BGA Solder Joints after Re-Balling Process

Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO

Partner Websites: void on bga after reflow oven (4306)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

temperature zones. The conveyor speed was 102 cm per minute with a standard air atmosphere environment. The oven used the high convection setting, and the boards were placed on the rails. 167 The test vehicles were allowed to air cool after reflow and then

Heller Industries Inc.

Reflow Wave Oven Reflow Oven Smd Smt Reflow Soldering Oven Reflow Oven Heating Reflow Oven Mini Smt

| https://www.smtfactory.com/Hot-Air-8-Trays-Electric-Reflow-Convection-Oven-with-High-Quality-pd48530624.html

: Leading SMT Supplier in China; Trade assurance to USD 560,000+; Professional after-sales service team. I.C.T T Series Lead Free Reflow Oven 1. Control System


void on bga after reflow oven searches for Companies, Equipment, Machines, Suppliers & Information

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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411

PCB Handling Machine with CE

World's Best Reflow Oven Customizable for Unique Applications
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Software for SMT placement & AOI - Free Download.
SMT feeders

Component Placement 101 Training Course
Professional technical team,good service, ready to ship- Various brands pick and place machine!