New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
SMT 158UL is a super-fast flow capillary underfill, which can flow into 10μm gap at room temperature without preheating a substrate. After cure there is void free in underfill. The cured SMT 158UL can be easily reworked. SMT 158UL not only can be use
SMT 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure, there is void free in underfill. The cured SMT 88UL can be easily reworked. SMT 88UL not only can be used a
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
Heller 860 Pressure Curing Oven PCO Reflow Oven SMT Reflow Oven Heller 860 Pressure Curing Oven PCO Pressure Curing Oven PCO Product description: Heller 860 Pressure Curing Oven PCO INQUIRY Heller 860 Pressure Curing Oven PCO P
Heller 860 Pressure Curing Oven PCO Reflow Oven SMT Reflow Oven Heller 860 Pressure Curing Oven PCO Product description: Heller 860 Pressure Curing Oven PCO Heller 860 Pressure Curing Oven PCO Specifications: A Pressure Cure Oven (PCO)
Heller 860 Pressure Curing Oven PCO Reflow Oven SMT Reflow Oven Heller 860 Pressure Curing Oven PCO Pressure Curing Oven PCO Product description: Heller 860 Pressure Curing Oven PCO INQUIRY Heller 860 Pressure Curing Oven PCO Pro
(Albany, NY) 1/3/2018 – YINCAE Advanced Materials has recently developed a low temperature curable reflowable (no flow) underfill: SMT 160L. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
