Electronics Forum | Mon Sep 17 14:45:57 EDT 2012 | kkay
We are experiencing voiding on one of our lead-free assemblies on every part. The voiding only occurs underneath the parts and not in the solder fillet (see pic). We have tried baking, curing, washing, multiple pastes and everything else we can think
Electronics Forum | Thu Jul 19 18:03:14 EDT 2007 | dwanzek
Wait...stop! Some adhesives will void when cured... some common branks... maybe already mentioned. Heraeus PD955 will minimize voiding when curing the adhesive. Voiding can have devestating consequences....learned from experience. Another key is kee
Electronics Forum | Fri Jul 20 08:16:48 EDT 2007 | hussman
Wow, I've never heard of this. If it voids during cure you either have a hot profile or bad adhesive. We use Loctite Chip Bonder. No problems.
Electronics Forum | Wed Dec 11 20:40:25 EST 2002 | davef
Se�or Tech Consider the following in evaluating your adhesive: * Determine the ability to dispense/print epoxy dots over the full range of application diameters/volumes. * Assess the ability to dispense/print epoxy without undesirable characteristic
Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo
No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux
Electronics Forum | Fri Sep 01 03:06:20 EDT 2000 | Adelina Baggayan
Hi!, Can anyone help me with problems with Solder voids after reflow curing on D2PAK heatsinks? I would like to remove the gas from the solder paste; can centrifuge help?How many minutes should a solder paste in a tube be processed in a softener? Ho
Electronics Forum | Tue May 02 07:46:39 EDT 2006 | Bob R.
Be careful about taking any generic advice and trying to use it to reduce voiding for your particular paste with your particular boards. I've done a few literature searches over the years on causes/cures for BGA voiding in the SnPb world and found a
Electronics Forum | Thu Mar 23 08:34:45 EST 2000 | Shane Lay
Dave, Thank you for the information. We will be conducting several tests in the near future that will evaluate the corrosion/contamination response as it is our primary concern once we remove our aqueous processes. We are well aware of the effects
Electronics Forum | Thu May 31 10:21:16 EDT 2001 | davef
On "Flip Chip/uBGA Under-fill Visual Standards" � The third "Satisfactory" [The under-fill if by design should be visible � ], here the notation "if by design" is unclear. Does "according to product documentation" get to the point? The first "Acc
Electronics Forum | Sun Jul 25 08:54:37 EDT 1999 | Tom Gervascio
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
