Industry News: voids in paste in hole (Page 1 of 5)

Largest Dispensing Platform in the Industry

Industry News | 2017-04-11 21:19:32.0

GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.

GPD Global

The Latest in Automatic Fluid Dispensing at IPC APEX EXPO 2024

Industry News | 2024-04-06 00:43:25.0

Live demos at IPC APEX Expo 2024 – Booth 1504 – April 9-11, 2024, Anaheim, CA GRAND JUNCTION, CO USA -- April 2024 -- GPD Global – manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix, and R&D production – will exhibit in Booth 1504 at IPC APEX EXPO 2024 on April 9-11 in the Anaheim Convention Center, CA.

GPD Global

GPD Global Live Demos at IPC APEX in Las Vegas Convention Center

Industry News | 2016-02-27 22:07:08.0

GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.

GPD Global

MIRTEC to Demonstrate the Latest in Their Award-Winning 3D AOI and SPI Systems at SMTAI

Industry News | 2019-08-21 16:55:59.0

MIRTEC will exhibit in Booth #305 at SMTA International. MIRTEC will showcase the latest advancements in their award-winning 3D AOI and SPI Systems at the two-day event.

MIRTEC Corp

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

Come. Focus. Participate in the industry's best conference. The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference.

Industry News | 2010-05-07 16:01:14.0

New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.

Surface Mount Technology Association (SMTA)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Pin In Hole, Pin in Paste or Selective Reflow CD from Bob Willis

Industry News | 2017-01-18 05:21:35.0

This photo CD ROM provides the process or quality engineer with a source of PIHR photographs of the assembly process, components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Now over 250 photographs are provided in either jpg or tif file format for use in PowerPoint, Word inspection standards or online publications royalty free http://www.bobwillis.co.uk/product-category/photo-cd-rom/

ASKbobwillis.com

Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components

Industry News | 2015-10-30 15:33:26.0

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

Indium Corporation

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