New SMT Equipment: voids on qfn thermal pad (2)

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

PACE IR 3000 Infrared BGA/SMT Rework System

PACE IR 3000 Infrared BGA/SMT Rework System

New Equipment | Rework & Repair Equipment

Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in

PACE Worldwide

Electronics Forum: voids on qfn thermal pad (37)

QFN Thermal pad voiding

Electronics Forum | Fri May 15 10:04:59 EDT 2009 | aj

Hi all, Is there any standard for percentage voiding on the center thermal pad on a QFN? We use the dot matrix array for paste to allow for outgassing etc, but we have had a couple of xray inspection "fails" for voiding on this pad , in or around 3

QFN Thermal pad voiding

Electronics Forum | Mon Jun 01 16:48:16 EDT 2009 | stevezeva

Mika, Have you ever worked with a 3-row I/O QFN? QFN180 to be exact? Steve

Industry News: voids on qfn thermal pad (13)

SMTA International to Address QFN Assembly & Reliability

Industry News | 2011-09-14 12:04:43.0

The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.

Surface Mount Technology Association (SMTA)

Technical Presentations at the Upcoming SMTA Capital Chapter Expo on August 23rd

Industry News | 2018-08-16 19:58:50.0

The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.

Surface Mount Technology Association (SMTA)

Technical Library: voids on qfn thermal pad (52)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Rework Challenges for Smart Phones and Tablets

Technical Library | 2015-04-23 18:48:18.0

Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.

Metcal

Videos: voids on qfn thermal pad (1)

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Videos

"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins

PACE Worldwide

Training Courses: voids on qfn thermal pad (3)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Express Newsletter: voids on qfn thermal pad (459)

Voiding Control for QFN Assembly

Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size

SMTnet Express - October 3, 2018

SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints

Partner Websites: voids on qfn thermal pad (99)

Intermetallic Growth on PCB

Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/

Component Cracking Intermetallic Growth on PCB Dull solder joints ×   Re-printed in partnership with ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad

Heller Industries Inc.

Download Webinars/Webtorials On-Demand

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm

  Jennie Hwang, Ph.D.  $200.00 2015  Shining a Light on LED Technology   Martine Simard-Normandin  Free! 2015  Process Optimization and Defect Elimination for PCB Assembly   Tim Jensen  $200.00 2015  Thermal Events

Surface Mount Technology Association (SMTA)


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